K
Kristof Croes
Researcher at Katholieke Universiteit Leuven
Publications - 164
Citations - 2389
Kristof Croes is an academic researcher from Katholieke Universiteit Leuven. The author has contributed to research in topics: Electromigration & Copper interconnect. The author has an hindex of 25, co-authored 137 publications receiving 1856 citations. Previous affiliations of Kristof Croes include Ghent University Hospital & IMEC.
Papers
More filters
Journal ArticleDOI
Cu pumping in TSVs: Effect of pre-CMP thermal budget
I. De Wolf,Kristof Croes,O. Varela Pedreira,Riet Labie,Augusto Redolfi,M. Van De Peer,Kris Vanstreels,Chukwudi Okoro,Bart Vandevelde,Eric Beyne +9 more
TL;DR: It is shown that to suppress Cu pumping a pre-CMP anneal is required that is either very long or at a temperature very close to the maximum temperature used in the BEOL processing.
Journal ArticleDOI
Persistent organic pollutants (POPs) in human milk: a biomonitoring study in rural areas of Flanders (Belgium).
Kristof Croes,Kristof Croes,Ann Colles,Gudrun Koppen,Eva Govarts,Liesbeth Bruckers,E. Van de Mieroop,Vera Nelen,Adrian Covaci,Alin C. Dirtu,Cathrine Thomsen,Line Småstuen Haug,Georg Becher,M. Mampaey,Greet Schoeters,N. Van Larebeke,Willy Baeyens +16 more
TL;DR: Interesting associations were found between the concentrations of POPs measured in human milk and personal characteristics as well as dietary habits of the study population.
Proceedings ArticleDOI
SOT-MRAM 300MM Integration for Low Power and Ultrafast Embedded Memories
Kevin Garello,F. Yasin,Sebastien Couet,Laurent Souriau,Johan Swerts,Siddharth Rao,S. Van Beek,W. Kim,Enlong Liu,Shreya Kundu,Diana Tsvetanova,Kristof Croes,N. Jossart,Eva Grimaldi,Manuel Baumgartner,D. Crotti,A. Fumemont,Pietro Gambardella,Gouri Sankar Kar +18 more
TL;DR: It is shown that 62 nm devices with a W-based SOT underlayer have very large endurance, sub-ns switching time of 210 ps, and operate with power as low as 300 pJ.
Journal ArticleDOI
Impact of Wire Geometry on Interconnect RC and Circuit Delay
Ivan Ciofi,Antonino Contino,Philippe Roussel,Rogier Baert,Victor-H. Vega-Gonzalez,Kristof Croes,Mustafa Badaroglu,Christopher J. Wilson,Praveen Raghavan,Abdelkarim Mercha,Diederik Verkest,Guido Groeseneken,Dan Mocuta,Aaron Thean +13 more
TL;DR: For a given pitch and dielectric stack height, the RC delay can be significantly reduced by targeting wider and deeper damascene trenches, that is, by trading capacitance for resistance, and that an optimal wire geometry for RC delay minimization exists.
Journal ArticleDOI
Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper.
Liang Gong Wen,Philippe Roussel,Olalla Varela Pedreira,B. Briggs,Benjamin Groven,Shibesh Dutta,Mihaela Popovici,Nancy Heylen,Ivan Ciofi,Kris Vanstreels,Frederik Westergaard Østerberg,Ole Hansen,Dirch Hjorth Petersen,Karl Opsomer,Christophe Detavernie,Christopher J. Wilson,Sven Van Elshocht,Kristof Croes,Jürgen Bömmels,Zsolt Tőkei,Christoph Adelmann +20 more
TL;DR: The void-free filling in sub-10 nm wide single damascene lines using an ALD process in combination with 2.5 Å of ALD TiN interface and postdeposition annealing shows that ruthenium can be used as a barrierless metallization in interconnects.