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I.J. Rasiah
Researcher at Honeywell
Publications - 2
Citations - 36
I.J. Rasiah is an academic researcher from Honeywell. The author has contributed to research in topics: Integrated circuit packaging & Thermal resistance. The author has an hindex of 2, co-authored 2 publications receiving 34 citations.
Papers
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Proceedings ArticleDOI
Thermal characterization of vias using compact models
TL;DR: In this paper, the accuracy of compact thermal via models with respect to the detailed models has been determined using PBGA 352 as the test vehicle and found that the accuracy is within 3%.
Proceedings ArticleDOI
Thermal design of heat spreader and analysis of thermal interface materials (TIM) for multi-chip package
Damaruganath Pinjala,N. Khan,Xie Ling,Poi-Siong Teo,Ee Hua Wong,M.K. Iyer,C. Lee,I.J. Rasiah +7 more
TL;DR: In this paper, a multi-chip package suitable for high performance devices is developed, which is capable of handling 2 GHz signal speed and dissipating 75 W power with an external thermal solution.