Proceedings ArticleDOI
Thermal design of heat spreader and analysis of thermal interface materials (TIM) for multi-chip package
Damaruganath Pinjala,N. Khan,Xie Ling,Poi-Siong Teo,Ee Hua Wong,M.K. Iyer,C. Lee,I.J. Rasiah +7 more
- pp 1119-1123
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TLDR
In this paper, a multi-chip package suitable for high performance devices is developed, which is capable of handling 2 GHz signal speed and dissipating 75 W power with an external thermal solution.Abstract:
Industry demand for high power multi-chip packages is increasing to realize multifunctional compact systems. In line with industry requirements a multi-chip package suitable for high performance devices is developed. The package has 1296 I/Os. It is capable of handling 2 GHz signal speed and dissipating 75 W power with an external thermal solution. A concurrent design approach is adopted for the package design. Electrical, thermal, structural issues and assembly, and materials limitations are considered in developing this package. Package level thermal design challenges involve optimization of package structure and selection of stable thermal interface material. As a part of this project, a simulation model of the package along with the external thermal solution is developed and validated by measurements. The optimized heat spreader has been designed by performing a parametric study with the validated model. The type of thermal interface material (TIM) suitable to the package has also been identified by measurements. Desired thermal performance of the package has been achieved through design optimization of the package and selection of suitable TIM. Thermal modeling and measurement methodologies, validation and parametric study results are presented in the paper. Analysis of TIMs and measured thermal performance results of packages assembled with different type of TIMs are also discussed in the paper.read more
Citations
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Journal ArticleDOI
Single-phase liquid cooled microchannel heat sink for electronic packages
TL;DR: In this article, a single-phase liquid-cooled microchannel heat sink for electronic packages is reported, and the measured junction to inlet fluid thermal resistances ranged from 0.44 to 0.32 °C/W for the 12 mm chip under the test flowrate range.
Journal ArticleDOI
Development of liquid cooling techniques for flip chip ball grid array packages with High Heat flux dissipations
TL;DR: In this article, a liquid-cooled aluminum heat sink with an area of 15 mm (L) /spl times/12.2 mm (W) populated by microchannels was designed and fabricated.
Journal ArticleDOI
Thermal analysis for indirect liquid cooled multichip module using computational fluid dynamic simulation and response surface methodology
TL;DR: In this paper, the authors demonstrate the application of computational fluid dynamic (CFD) simulation and response surface methodology (RSM) in analyzing the thermal performance of a high input/outputs, seven chips, indirect liquid cooled multichip module which will be applied in a kind of supercomputer.
Proceedings ArticleDOI
Effects of assembly process variables on voiding at a thermal interface
TL;DR: In this article, the effects of assembly process parameters are not sufficiently accounted for in the optimization of thermal interface performance and voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip.
Proceedings ArticleDOI
Predicting thermo-mechanical degradation of first-level thermal interface materials (TIMs) in flip-chip electronic packages
TL;DR: In this article, a technique to predict the thermal damage in TIMs over cyclic loading is presented, which is then correlated with experimentally observed thermal degradation and finally, a phenomenological model is developed which predicts the thermal performance of an electronic package during cyclic load.
References
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Journal ArticleDOI
An investigation of thermal enhancement on flip chip plastic BGA packages using CFD tool
TL;DR: In this article, the authors demonstrate the advantage of applying predictive engineering in the thermal assessment of a 279 inputs/outputs (I/Os), six-layer, depopulated array flip chip PBGA package.
Proceedings ArticleDOI
Thermal simulation and validation of the fast static RAM 164-lead FC-PBGA package with investigations of package thermal performance in a generic CPU module
M. Eyman,Z. Johnson,B. Joiner +2 more
TL;DR: In this article, the steadystate thermal performance of the 164-lead flip chip plastic ball grid array (FC-PBGA) under low to moderate convective air cooling conditions has been simulated through finite element (FE) methods and computational fluid dynamics (CFD) methods.
Journal Article
Thermal design of Pentium ®II xeon processor cartridge
TL;DR: In this article, the design of the Slot 2 Single Edge Contact (S.E.C.) cartridge is discussed and a method to enhance the power handling capability by changing the L2 cache layouts and using conductive coupling to the thermal plate is highlighted.
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