Silicon nanowire-based solar cells on metal foil are described. The key benefits of such devices are discussed, followed by optical reflectance, current-voltage, and external quantum efficiency data for a cell design employing a thin amorphous silicon layer deposited on the nanowire array to form the p-n junction. A promising current density of ∼1.6mA∕cm2 for 1.8cm2 cells was obtained, and a broad external quantum efficiency was measured with a maximum value of ∼12% at 690nm. The optical reflectance of the silicon nanowire solar cells is reduced by one to two orders of magnitude compared to planar cells.

Silicon nanowire solar cells

With a global market share of about 90%, crystalline silicon is by far the most important photovoltaic technology today. This article reviews the dynamic field of crystalline silicon photovoltaics from a device-engineering perspective. First, it discusses key factors responsible for the success of the classic dopant-diffused silicon homojunction solar cell. Next it analyzes two archetypal high-efficiency device architectures – the interdigitated back-contact silicon cell and the silicon heterojunction cell – both of which have demonstrated power conversion efficiencies greater than 25%. Last, it gives an up-to-date summary of promising recent pathways for further efficiency improvements and cost reduction employing novel carrier-selective passivating contact schemes, as well as tandem multi-junction architectures, in particular those that combine silicon absorbers with organic–inorganic perovskite materials.

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High-efficiency crystalline silicon solar cells: status and perspectives

Excellent surface passivation of c-Si has been achieved by Al2O3 films prepared by plasma-assisted atomic layer deposition, yielding effective surface recombination velocities of 2 and 13cm∕s on low resistivity n- and p-type c-Si, respectively. These results obtained for ∼30nm thick Al2O3 films are comparable to state-of-the-art results when employing thermal oxide as used in record-efficiency c-Si solar cells. A 7nm thin Al2O3 film still yields an effective surface recombination velocity of 5cm∕s on n-type silicon.

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Ultralow surface recombination of c-Si substrates passivated by plasma-assisted atomic layer deposited Al2O3

Pentacene stands out as a model molecule among organic semiconductors due to its ability to form well-ordered films that show a high field effect mobility. We discuss the processes involved in pentacene film growth, emphasizing differences with respect to inorganic films. The influence of growth parameters such as the substrate nature and temperature, the deposition rate, and the kinetic energy of the molecular beam on the structure and morphology of pentacene films are discussed. Finally, we overview recent attempts to model pentacene film nucleation and growth, and draw attention to the role of dislocations.

Pentacene Thin Film Growth

Al2O3 is a versatile high-κ dielectric that has excellent surface passivation properties on crystalline Si (c-Si), which are of vital importance for devices such as light emitting diodes and high-efficiency solar cells. We demonstrate both experimentally and by simulations that the surface passivation can be related to a satisfactory low interface defect density in combination with a strong field-effect passivation induced by a negative fixed charge density Qf of up to 1013 cm−2 present in the Al2O3 film at the interface with the underlying Si substrate. The negative polarity of Qf in Al2O3 is especially beneficial for the passivation of p-type c-Si as the bulk minority carriers are shielded from the c-Si surface. As the level of field-effect passivation is shown to scale with Qf2, the high Qf in Al2O3 tolerates a higher interface defect density on c-Si compared to alternative surface passivation schemes.

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On the c-Si surface passivation mechanism by the negative-charge-dielectric Al2O3

Excellent passivation properties of intrinsic amorphous silicon carbide (a-SiCx:H) films deposited by plasma enhanced chemical vapor deposition on single-crystalline silicon (c-Si) wafers have been obtained. The dependence of the effective surface recombination velocity, Seff, on deposition temperature, total pressure and methane (CH4) to silane (SiH4) ratio has been studied for these films using lifetime measurements made with the quasi-steady-state photoconductance technique. The dependence of the effective lifetime, τeff, on the excess carrier density, Δn, has been measured and also simulated through a physical model based on Shockley–Read–Hall statistics and an insulator/semiconductor structure with fixed charges and band bending. A Seff at the a-SiCx:H/c-Si interface lower than 30 cm s−1 was achieved with optimized deposition conditions. This passivation quality was found to be three times better than that of noncarbonated amorphous silicon (a-Si:H) films deposited under equivalent conditions.

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Surface passivation of p-type crystalline Si by plasma enhanced chemical vapor deposited amorphous SiC x :H films

http://www.icfo.eu/images/publications/J04-012.pdf

Pentacene thin-film transistors with polymeric gate dielectric

Over the last few years, transition metal oxide layers have been proposed as selective contacts both for electrons and holes and successfully applied to silicon solar cells. However, better published results need the use of both a thin and high quality intrinsic amorphous Si layer and TCO (Transparent Conductive Oxide) films. In this work, we explore the use of vanadium suboxide (V2Ox) capped with a thin Ni layer as a hole transport layer trying to avoid both the intrinsic amorphous silicon layer and the TCO contact layer. Obtained figures of merit for Ni/V2Ox/c-Si(n) test samples are saturation current densities of 175 fA cm−2 and specific contact resistance below 115 mΩ cm2 on 40 nm thick V2Ox layers. Finally, the Ni/V2Ox stack is used with an interdigitated back-contacted c-Si(n) solar cell architecture fully fabricated at low temperatures. An open circuit voltage, a short circuit current and a fill factor of 656 mV, 40.7 mA cm−2 and 74.0% are achieved, respectively, leading to a power conversion efficiency of 19.7%. These results confirm the high potential of Ni/V2Ox stacks as hole-selective contacts on crystalline silicon photovoltaics.

V2Ox-based hole-selective contacts for c-Si interdigitated back-contacted solar cells

Pentacene thin-films obtained by thermal evaporation in high vacuum

In this work we study the optimization of laser-fired contact (LFC) processing parameters, namely laser power and number of pulses, based on the electrical resistance measurement of an aluminum single LFC point. LFC process has been made through four passivation layers that are typically used in c-Si and mc-Si solar cell fabrication: thermally grown silicon oxide (SiO2), deposited phosphorus-doped amorphous silicon carbide (a-SiCx/H(n)), aluminum oxide (Al2O3) and silicon nitride (SiNx/H) films. Values for the LFC resistance normalized by the laser spot area in the range of 0.65–3 mΩ cm2 have been obtained. Copyright © 2011 John Wiley & Sons, Ltd.

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Isidro Martín

Papers

Surface passivation of p-type crystalline Si by plasma enhanced chemical vapor deposited amorphous SiC x :H films

Pentacene thin-film transistors with polymeric gate dielectric

V2Ox-based hole-selective contacts for c-Si interdigitated back-contacted solar cells

Pentacene thin-films obtained by thermal evaporation in high vacuum

Laser‐fired contact optimization in c‐Si solar cells