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J. W. Kim

Researcher at University of California, Los Angeles

Publications -  7
Citations -  4422

J. W. Kim is an academic researcher from University of California, Los Angeles. The author has contributed to research in topics: Pseudocapacitance & Miscibility. The author has an hindex of 5, co-authored 7 publications receiving 3326 citations. Previous affiliations of J. W. Kim include Chung-Ang University.

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High-rate electrochemical energy storage through Li+ intercalation pseudocapacitance

TL;DR: This work quantifies the kinetics of charge storage in T-Nb2O5: currents that vary inversely with time, charge-storage capacity that is mostly independent of rate, and redox peaks that exhibit small voltage offsets even at high rates.
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The Effect of Crystallinity on the Rapid Pseudocapacitive Response of Nb2O5

TL;DR: In this article, the electrochemical properties of Nb2O5 were investigated and it was shown that the orthorhombic and pseudohexagonal phases of the material undergo fast faradaic reactions that lead to high specific capacitance in short charging times.
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Electrochemical Kinetics of Nanostructured Nb2O5 Electrodes

TL;DR: In this paper, Li+ intercalation within specific planes in the orthorhombic structure is characterized as being an intrinsic property of Nb2O5 that facilitates the design of electrodes for capacitive storage devices.
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Fabrication of membranes for the liquid separation: Part 2: Microfiltration membranes prepared from immiscible blends containing polysulfone and poly(1-vinylpyrrolidone-co-acrylonitrile) copolymers

TL;DR: In this paper, microfiltration membranes are prepared from immiscible blends of polysulfone (PSf) and poly(1-vinylpyrrolidone-co-acrylonitrile) copolymers via traditional phase inversion process.
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Metal-Matrix Nanocomposites with Tailored Coefficients of Thermal Expansion for Improved Thermomechanical Reliability

TL;DR: In this article, the authors describe the development of metal-matrix nanocomposites with tailorable negative thermal expansion (CTEs) for use as electrodes or as interfacial bonding layers for creating segmented TE elements.