J
Jan D'Haen
Researcher at IMEC
Publications - 317
Citations - 11570
Jan D'Haen is an academic researcher from IMEC. The author has contributed to research in topics: Thin film & Aqueous solution. The author has an hindex of 48, co-authored 302 publications receiving 10180 citations. Previous affiliations of Jan D'Haen include Katholieke Universiteit Leuven & Transnational University Limburg.
Papers
More filters
Journal ArticleDOI
Correlation between the interface structure of a TiN coating deposited onto AISI 304 and the coating adhesion
TL;DR: WTCM,SCI & TECH CTR METALWORKING IND,B-3590 DIEPENBEEK,BELGIUM as mentioned in this paper,C, INST MAT RES,DIV MAT PHYS.
Journal ArticleDOI
Elucidation of the Growth Mechanism of Sputtered 2D Hexagonal Boron Nitride Nanowalls
Duc-Quang Hoang,Duc-Quang Hoang,Paulius Pobedinskas,Paulius Pobedinskas,Shannon S. Nicley,Shannon S. Nicley,Stuart Turner,Stoffel D. Janssens,Stoffel D. Janssens,Marlies K. Van Bael,Marlies K. Van Bael,Jan D'Haen,Jan D'Haen,Ken Haenen,Ken Haenen +14 more
TL;DR: In this paper, a hexagonal boron nitride nanowall thin films were deposited on Si(100) substrates using a Ar(51%)/N2(44%)/H2(5%) gas mixture.
Journal ArticleDOI
Enhancement of Tc by substituting strontium for barium in the YBa2Cu4O8 superconductor prepared by a sol-gel method
M. K. Van Bael,Aivaras Kareiva,G. Vanhoyland,Jan D'Haen,Marc D'olieslaeger,Dirk Franco,Carl Quaeyhaegens,Jan Yperman,Jules Mullens,L.C. Van Poucke +9 more
TL;DR: In this paper, the influence of strontium substitution on YBa2Cu4O8 was studied by thermogravimetric analysis, X-ray powder diffraction, scanning electron microscopy and resistivity measurements.
Journal ArticleDOI
Generalized Wagner's diffusion model of surface modification of materials by plasma diffusion treatment
TL;DR: In this article, the model is simplified by considering the compound layer as a united one, which can be used as a method for the experimental determining of the effective diffusion coefficients and the erosion rate during plasma treatment of material surfaces.
Proceedings ArticleDOI
Influence of copper purity on microstructure and electromigration
Sywert Brongersma,K. Vanstreels,Wen Wu,W. Zhang,Didem Ernur,Jan D'Haen,Valentina Terzieva,M. A. Van Hove,Trudo Clarysse,L. Carbonell,W. Vandervorst,W. De Ceuninck,Karen Maex +12 more
TL;DR: In this paper, the authors demonstrate how impurity and microstructural properties of the bulk copper can influence failures at the copper/dielectric barrier interface and show that a higher impurity concentration in the copper increases the formation of microvoids during anneal and reduces the annealing rate, which results in reduced electromigration lifetime.