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Jan D'Haen

Researcher at IMEC

Publications -  317
Citations -  11570

Jan D'Haen is an academic researcher from IMEC. The author has contributed to research in topics: Thin film & Aqueous solution. The author has an hindex of 48, co-authored 302 publications receiving 10180 citations. Previous affiliations of Jan D'Haen include Katholieke Universiteit Leuven & Transnational University Limburg.

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Journal ArticleDOI

Cable Bacteria as Long-Range Biological Semiconductors

TL;DR: In this paper, the intrinsic electrical properties of individual cable bacterium filaments were determined and an equivalent electrical circuit model, characterising cable bacteria as resistive biological wires was retrieved, and temperature dependent experiments revealed that the charge transport is thermally activated, and can be described with an Arrhenius-type relation over a broad temperature range (-196°C to +50°C), thus excluding metal-like electron transport.
Journal ArticleDOI

Development and thermo-mechanical reliability assessment of fiber reinforced polymers in lightweight PV modules towards vehicle-integrated photovoltaics

TL;DR: In this article , the authors investigated the thermo-mechanical behavior of lightweight c-Si photovoltaic (PV) modules with a multiwire design specifically aiming to VIPV applications.
Journal ArticleDOI

P3HT:PCBM Bulk Heterojunction Solar Cells: Morphological And Electrical Characterization And Performance Optimization

TL;DR: In this paper, the performance of organic solar cells based on the blend of regioregular poly(3-hexylthiophene) (P3HT) and phenyl-C61-butyric acid methyl ester (PCBM) is analyzed.
Book ChapterDOI

The Interface Between TiN Coatings and AISI 304 Steel Substrates for Different Deposition Conditions: A Transmission Electron Microscopy Study

TL;DR: In this article, the interface between PVD TiN layers and austenitic stainless steel AISI 304 substrates has been studied by means of plan-view and cross-sectional transmission electron microscopy (XTEM).
Journal Article

MTF test system with AC based dynamic joule correction for electromigration tests on interconnects

TL;DR: A new test system has been developed which makes use of an AC-current based dynamic joule correction which ensures that no electromigration effects take place during the determination of the thermal resistance.