J
Jeffrey W. Kysar
Researcher at Columbia University
Publications - 148
Citations - 24473
Jeffrey W. Kysar is an academic researcher from Columbia University. The author has contributed to research in topics: Deformation (engineering) & Electron backscatter diffraction. The author has an hindex of 35, co-authored 139 publications receiving 21356 citations. Previous affiliations of Jeffrey W. Kysar include Columbia University Medical Center & Harvard University.
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Wedge indentation into elastic–plastic single crystals. 2: Simulations for face-centered cubic crystals
TL;DR: The asymptotic stress and deformation fields associated with the contact point singularity of a nearly-flat wedge indenter impinging on a specially oriented single face-centered cubic crystal are derived analytically in a companion paper as discussed by the authors.
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Publisher's Note: Nonlinear elastic behavior of two-dimensional molybdenum disulfide [Phys. Rev. B 87, 035423 (2013)]
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Wedge indentation into elastic–plastic single crystals, 1: Asymptotic fields for nearly-flat wedge
Yuki Saito,Jeffrey W. Kysar +1 more
TL;DR: In this paper, the asymptotic stress and deformation fields under the contact point singularities of a nearly-flat wedge indenter and of a flat punch are derived for elastic ideally-plastic single crystals with three effective in-plane slip systems that admit a plane strain deformation state.
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Facile and quantitative estimation of strain in nanobubbles with arbitrary symmetry in 2D semiconductors verified using hyperspectral nano-optical imaging.
Thomas Darlington,Andrey Krayev,Vishal Venkatesh,Ravindra Saxena,Jeffrey W. Kysar,Nicholas J. Borys,Deep Jariwala,P. James Schuck +7 more
TL;DR: An easily implemented numerical method to solve for strain tensors of nanobubbles with arbitrary symmetry in 2D crystals with topographic information from atomic force microscopy and the Poisson ratio of the 2D material is presented.
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Residual plastic strain recovery driven by grain boundary diffusion in nanocrystalline thin films
Xiaoding Wei,Jeffrey W. Kysar +1 more
TL;DR: In this paper, free-standing copper films of submicron thickness with an average grain size of about 40nm are mechanically loaded via a plane-strain bulge test, and residual strain recovery at room temperature is characterized after unloading.