J
John Owen Dukovic
Researcher at IBM
Publications - 32
Citations - 3626
John Owen Dukovic is an academic researcher from IBM. The author has contributed to research in topics: Electroplating & Anode. The author has an hindex of 23, co-authored 32 publications receiving 3553 citations.
Papers
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Journal ArticleDOI
Damascene Copper electroplating for chip interconnections
TL;DR: The challenges of filling trenches and vias with Cu without creating a void or seam are reviewed, and the discovery that electrodeposition can be engineered to give filling performance significantly better than that achievable with conformal step coverage is found.
Damascene copper electroplating for chip interconnections
TL;DR: Damascene copper electroplating for on-chip interconnections, a process that was conceived and developed in the early 1990s, makes it possible to fill submicron trenches and vias with copper without creating a void or a seam and has thus proven superior to other technologies of copper deposition as discussed by the authors.
Patent
Vertical paddle plating cell
Panayotis C. Andricacos,Kirk G. Berridge,John Owen Dukovic,Matteo Flotta,Jose Ordonez,Helmut R. Poweleit,Jeffrey S. Richter,Lubomyr T. Romankiw,Otto P. Schick,Frank A. Spera,Kwong-Hon Wong +10 more
TL;DR: An electroplating cell includes a floor, ceiling, front wall, and back wall forming a box having first and second opposite open ends as mentioned in this paper, with a rack for supporting an article to be electroplated is removably positioned vertically to close the first open end and includes a thief laterally surrounding the article to define a cathode.
Journal ArticleDOI
Electrodeposition of Nickel‐Iron Alloys I . Effect of Agitation
TL;DR: In this article, an analysis of partial currents as a function of electrode potential has shown that the Fe deposition reaction is mass-transport controlled at sufficient cathodic potentials, and that the diffusivity of the Fe2+ ion is the same for both the reduction to Fe0 and the oxidation to Fe3+.
Patent
Electric potential shaping apparatus for holding a semiconductor wafer during electroplating
Steve Taatjes,Jonathan D. Reid,Evan E. Patton,Jingbin Feng,John Owen Dukovic,Robert J. Contolini +5 more
TL;DR: In this paper, a clamshell is mounted on a rotatable spindle to treat the surface of a substrate and gas bubbles entrapped on the substrate surface can readily escape.