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Krishnan Balasubramaniam

Researcher at Indian Institute of Technology Madras

Publications -  493
Citations -  7351

Krishnan Balasubramaniam is an academic researcher from Indian Institute of Technology Madras. The author has contributed to research in topics: Ultrasonic sensor & Lamb waves. The author has an hindex of 40, co-authored 486 publications receiving 6266 citations. Previous affiliations of Krishnan Balasubramaniam include University of Colorado Boulder & Marshall Space Flight Center.

Papers
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Laser line scanning thermography for surface breaking crack detection : modeling and experimental study

TL;DR: In this paper, the potentiality of laser line thermography in crack detection at room temperature was investigated, and a 3D model for laser thermography was developed for the heat distribution during laser heating and validated with experimental results.
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Ultrasonic torsional guided wave sensor for flow front monitoring inside molds.

TL;DR: An ultrasonic torsional guided wave sensor has been discussed for monitoring the movement of flow front during filling of resins in opaque molds.
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Assessment of sensitization in AISI 304 stainless steel by nonlinear ultrasonic method

TL;DR: In this paper, a nonlinear ultrasonic technique has been developed to evaluate sensitization in Type 304 stainless steel and the results showed a good correlation between the degree of sensitization measured by the electrochemical potentiokinetic reactivation test and the ultrasonic nonlinearity parameter.
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The disappearing solar filament of 2003 june 11: a three-body problem

TL;DR: In this paper, the authors show that the magnetic disturbance propagates from a mature active region to a quiescent filament by direct magnetic connection, but does so indirectly via magnetic coupling with the established region.
Patent

In-situ, real time viscosity measurement of molten materials with laser induced ultrasonics

TL;DR: In this article, a method of remotely measuring the viscosity of molten materials such as melt glass, melt alloys, etc. during processing of the material is proposed. But this method is not suitable for the processing of complex materials.