scispace - formally typeset
L

Liang Ding

Researcher at National University of Defense Technology

Publications -  170
Citations -  2334

Liang Ding is an academic researcher from National University of Defense Technology. The author has contributed to research in topics: Thin film & Computer science. The author has an hindex of 22, co-authored 152 publications receiving 1782 citations. Previous affiliations of Liang Ding include University of Texas–Pan American & Nanyang Technological University.

Papers
More filters
Journal ArticleDOI

RNAIndel: discovering somatic coding indels from tumor RNA-Seq data

TL;DR: Except for tumor samples with microsatellite instability, RNAIndel robustly predicts 88‒100% of somatic indels in five diverse test data sets of pediatric and adult cancers, even recovering subclonal driver indels missed by targeted deep-sequencing.
Journal ArticleDOI

Electrical characteristics of Si nanocrystal distributed in a narrow layer in the gate oxide near the gate synthesized with very-low-energy ion beams

TL;DR: A nanocrystal Si (nc-Si) distributed in a narrow layer in the gate oxide close to the gate is synthesized with Si ion implantation at 2keV, and the electrical characteristics of the nc-Si structure are investigated as discussed by the authors.
Journal ArticleDOI

Influence of implantation dose on electroluminescence from Si-implanted silicon nitride thin films

TL;DR: In this paper, the influence of the implanted Si ion dose on both the current conduction and EL properties has been studied and it was shown that a larger excess Si concentration leads to a higher EL intensity, but the light emission efficiency is reduced.
Journal ArticleDOI

Photon-induced conduction modulation in SiO2 thin films embedded with Ge nanocrystals

TL;DR: In this article, the photon-induced conduction modulation in SiO2 thin films embedded with germanium nanocrystals (nc-Ge) was investigated, where the conduction of the oxide could be switched to a higher or lower conductance state by a ultraviolet (UV) illumination.
Proceedings ArticleDOI

Polymer-based fine pitch Cu RDL to enable cost-effective re-routing for 2.5D interposer and 3D-IC

TL;DR: In this paper, 2 metal layers, very fine pitch Cu RDL process using spin-on photo-pattern-able polymer based material was demonstrated, with Cu wiring of a minimum of 2μm/2-μm line/space (L/S) and dielectric via diameter of 2 μm.