L
Liangchi Zhang
Researcher at Southern University of Science and Technology
Publications - 553
Citations - 16152
Liangchi Zhang is an academic researcher from Southern University of Science and Technology. The author has contributed to research in topics: Grinding & Machining. The author has an hindex of 62, co-authored 523 publications receiving 13759 citations. Previous affiliations of Liangchi Zhang include Center for Advanced Materials & Harbin Institute of Technology.
Papers
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A finite element analysis of fibre fracture in a polymer composite during vibration-assisted cutting
Weixing Xu,Liangchi Zhang +1 more
TL;DR: In this article, the authors investigated the fiber fracture mechanisms during the elliptic vibration-assisted (EVA) cutting of fiber-reinforced polymer (FRP) composites and found that bending-dominated fracture is prevalent above the cutting path.
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Microcracking in Monocrystalline Silicon due to Indentation and Scratching
I. Zarudi,Liangchi Zhang +1 more
TL;DR: In this paper, the authors discussed the cracking in monocrystalline silicon induced by microindentation with spherical and Berkovich indenters and scratching and found that cracks always commenced in a specimen's subsurface beneath the transformation zone.
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Kinematic modeling of surface topography ground by an electroplated diamond wheel
TL;DR: In this article, a three-dimensional kinematic simulation of surface topography ground by a D301 electroplated diamond wheel is presented, and the predicted surface roughness is close to the theoretical and experimental values with relative errors of − 7.9% and − 3.3% for aluminum and fused silica, respectively.
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Fast Polishing of Single Crystal Diamond
Yiqing Chen,Liangchi Zhang +1 more
TL;DR: In this paper, the authors investigated the dynamic friction method for single crystal diamond polishing and found that by selecting a proper polishing pressure and sliding speed, a very high polishing rate at 10,300 µm/h (or 28 X 10-2 mg/s) with a high quality surface finish can be reached, which is hundreds times faster than the other polishing process reported in the literature.
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Transient thermal analysis of sapphire wafers subjected to thermal shocks
TL;DR: In this paper, a model of a single sapphire wafer was developed to analyze the transient heat conduction in conjunction with the heat radiation and heat convection on the wafer surfaces.