Showing papers by "Luca Perregrini published in 2014"

A Formula for Radiation Loss in Substrate Integrated Waveguide

Abstract: Substrate integrated waveguide, an emerging tech- nology for microwave and millimeter-wave circuits, is affected by three loss mechanisms: ohmic and dielectric losses, standard waveguides, and radiation leakage. While ohmic and dielectric losses can be accurately determined by the analytical formulas of the equivalent rectangular waveguide, no equations are available for radiation leakage. This paper presents the derivation of a formula to calculate the attenuation constant due to radiation leakage in substrate integrated waveguide interconnects. Index Terms—Attenuation constant, electromagnetic modeling, radiation leakage, radiation loss, substrate integrated waveguide (SIW).

Modeling of losses in substrate integrated waveguide components

Abstract: This paper presents recent advances in the electromagnetic modeling of substrate integrated waveguide (SIW) components. In particular, the modeling of different aspects is discussed, namely the dispersion characteristics, the losses, and the overall device simulation. The different modeling approaches, based on semi-analytical formulas, full-wave simulations and equivalent circuits are presented.

Chipless RFID for space applications

Abstract: Recent works reveal a great deal of interest in the subject of wireless passive sensor for space applications. In particular, wireless passive tags can be employed during in-flight operations as well as during ground test campaigns, thanks to their robustness in extreme environments since they do not contain batteries nor any active electronic circuits. Chipless backscatter-based radio frequency identification (RFID) could be a valid alternative to surface acoustic wave (SAW) imple-mentations, especially for short-range applications like sensor monitoring aboard of satellite systems. In this work we present chipless RFIDs based on resonant substrate integrated waveguide (SIW) cavities, showing both the experimental characterization and system simulations, proving the solution feasibility for their usage on space platforms.

The BI-RME method: An historical overview

Abstract: This paper will provide an historical overview of the development of the BI-RME method. The original idea behind the BI-RME method - dating back to late seventies - will be briefly described, and its application to the development of specific algorithms and computer codes for the analysis and design of several classes of components and circuits will be reported.

Advanced modeling and design of substrate integrated waveguide components

Abstract: This paper presents some recent advances in the electromagnetic modeling and design of substrate integrated waveguide (SIW) components. The modeling of losses in SIW structures is discussed in details, and a new formula for the calculation of the attenuation constant due to radiation loss is introduced. In addition, an efficient technique for the modeling of arbitrarily shaped SIW components is discussed: this technique is based on the Boundary Integral-Resonant Mode Expansion (BI-RME) method. The BI-RME method permits the direct derivation of parametric and multimodal equivalent circuit models of SIW discontinuities, which can be adopted in the fast design of SIW components and systems.

Full-wave analysis and equivalent circuit modeling of substrate integrated waveguide (SIW) circuits

Abstract: The modeling and design of substrate integrated waveguide (SIW) circuits requires sophisticated electromagnetic solvers, which provide reliable results, fast computing time, and high flexibility to fully exploit the potential of SIW technology. This paper presents the outline of the full-wave analysis of SIW circuits by the Boundary Integral-Resonant Mode Expansion (BI-RME) method. In addition, the derivation of multimodal and parametric equivalent circuit modeling of SIW discontinuities. The use of equivalent circuit models is particularly useful for the fast design of SIW circuits, as well as for the sensitivity and yield analysis.

Innovative technique for substrate integrated waveguide implementation on paper substrate

Abstract: This paper presents a novel technique for the implementation of substrate integrated waveguide components based on paper substrate. The aim of the work is to develop a new class of microwave devices where the main advantages are the eco-compatibility and the low cost. These aspects match the requirements of microwave components for the new generation wireless sensor networks. The key points of this work are the manufacturing process based on physical etching of a metal layer and the implementation of a substrate integrated waveguide components on paper. In order to verify the reliability of the manufacturing process, two preliminary designs are proposed: a two poles band-pass filter and a cavity backed antenna both operating at 4 GHz.

Cryogenic dual-temperature low noise amplifier in K band

Abstract: Future ground stations will require a high level of operational flexibility and, for this reason, the possibility to adjust their receiving performance (i.e. signal-over-noise) is beneficial. This study presents an approach to achieve this flexibility based on a dual-temperature low-noise amplifier, which can be normally operated at room temperature (300 K), reducing the operational and maintenance costs, and at cryogenic temperature (103 K) only when required, for example, for critical mission supports. To demonstrate the effectiveness of this solution, a dual-temperature K-band low-noise amplifier is designed, manufactured and measured for the first time. Critical aspects, such as the stability of the electromagnetic response over the entire temperature range, and the reduction of the thermal load from the entire assembly, fundamental for a fast transition between room and cryogenic temperatures, are discussed. In particular, the low-noise amplifier exhibits a minimum gain of 20 dB over the entire working bandwidth (18–22 GHz) and a maximum noise figure of 2.2 at 300 K and 1.4 at 103 K, with a transition time between room and cryogenic temperature of <120 min because of a total thermal load lower than 1 W.

Analysis, design, and sensitivity study of substrate integrated waveguide circuits by using equivalent circuit models

Abstract: The design of complex substrate integrated waveguide (SIW) circuits requires the use of sophisticated full-wave simulation tools. When the complexity of the circuit increases, the computational effort required for the analysis and especially for the optimization of complex SIW circuits becomes prohibitive. For this reason the use of equivalent circuit models is very beneficial. This paper presents the derivation of parametric and multimodal equivalent circuit models of SIW discontinuities, based on the boundary integral-resonant mode expansion (BI-RME) method. To proof the validity of the models, the use of these equivalent circuits for the modeling and design of some SIW circuits, as well as for fast sensitivity study, is presented.

MoM/BI-RME method for the modeling of frequency selective surfaces and printed circuits

Abstract: This paper outline the basic theory and describes the most significant applications of the MoM/BI-RME method for the modeling of planar periodic structures and printed circuits. The MoM/BI-RME method is based on the solution of an integral equation by the Method of Moments (MoM) with entire-domain basis functions. In the case of arbitrarily shaped domains, the basis functions are calculated numerically by the Boundary Integral-Resonant Mode Expansion (BI-RME) method. The MoM/BI-RME method has been applied to the modeling of a variety of structures, including frequency selective surfaces, reflectarrays, shielded microwave printed circuits, and electromagnetic band-gap structures. An outline of the major applications is reported in this paper.

Crosstalk in Substrate Integrated Waveguides: A semi-analytical approach based on side leakage

Abstract: Substrate Integrated Waveguide, an emerging technology for microwave and mm-wave circuits, merges the advantages of planar manufacturing techniques (e.g. cost, weight, integration) while offering some benefits of tradition all-metal waveguides (e.g. high quality factor). However, a limit to the integration possibilities is posed by the lateral leakage, a typical aspect of Substrate Integrated Waveguide, which causes a crosstalk between adjacent transmission lines. This paper describes a semi-analytical approach, based on the calculation of the side leakage, able to predict the expected crosstalk between two adjacent transmission lines. A comparison with measured results is proposed.

Analysis of lossy waveguide circuits by the BI-RME method and a perturbation technique

Abstract: In this paper the extension of the Boundary Integral-Resonant Mode Expansion (BI-RME) method to the modeling of lossy waveguide components is discussed. The proposed technique is based on the combination of the BI-RME method and of a perturbation approach. The generalized admittance matrix of the circuit, which is provided by the BI-RME method as a pole-expansion in the frequency domain, is perturbed to account for both metallic and dielectric losses. Since the BI-RME method applies to homogeneously filled waveguide components, a segmentation technique is adopted in case of a piece-wise homogeneous dielectric medium. The effectiveness of the proposed technique is demonstrated through examples.

Perturbation modeling of high-loss waveguide components by the BI-RME method

Abstract: This paper presents the application of the Boundary Integral-Resonant Mode Expansion (BI-RME) method to the modeling of waveguide components comprising lossy dielectric materials. The proposed technique is based on the combination of the BI-RME method and of a perturbation approach. The BI-RME method yields the frequency response in terms of the generalized admittance matrix, expressed as a pole expansion in the frequency domain. The inclusion of dielectric losses by the perturbation approach is mainly performed by considering the quality factor of the modes of the cavity obtained by short-circuiting the ports of the circuit. The BI-RME method can be applied to waveguide components filled with a piece-wise homogeneous dielectric medium, by adopting the segmentation technique. Two examples are presented to validate the accuracy and robustness of the proposed method.