M
M.J. de Boer
Researcher at University of Twente
Publications - 92
Citations - 3413
M.J. de Boer is an academic researcher from University of Twente. The author has contributed to research in topics: Surface micromachining & Wafer. The author has an hindex of 30, co-authored 92 publications receiving 3233 citations. Previous affiliations of M.J. de Boer include University of Groningen & MESA+ Institute for Nanotechnology.
Papers
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Journal ArticleDOI
Silicon micromachined hollow microneedles for transdermal liquid transport
Han Gardeniers,Regina Luttge,Erwin Berenschot,M.J. de Boer,S.Y. Yeshurun,Meir Hefetz,R. van't Oever,A. van den Berg +7 more
TL;DR: In this article, an out-of-plane hollow microneedles are fabricated using a sequence of deep-reactive ion etching (DRIE), anisotropic wet etching and conformal thin film deposition.
Journal ArticleDOI
Guidelines for etching silicon MEMS structures using fluorine high-density plasmas at cryogenic temperatures
M.J. de Boer,Johannes G.E. Gardeniers,Henri Jansen,E. Smulders,M.-J. Gilde,G. Roelofs,J.N. Sasserath,Miko Elwenspoek +7 more
TL;DR: In this paper, the authors present guidelines for the deep reactive ion etching (DRIE) of silicon MEMS structures, employing SF/sub 6/O/sub 2/based high-density plasmas at cryogenic temperatures.
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Black silicon method X: a review on high speed and selective plasma etching of silicon with profile control: an in-depth comparison between Bosch and cryostat DRIE processes as a roadmap to next generation equipment
TL;DR: In this article, an intensive study has been performed to understand and tune deep reactive ion etch (DRIE) processes for optimum results with respect to the silicon etch rate, etch profile and mask etch selectivity.
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Micromachining of buried micro channels in silicon
M.J. de Boer,R.W. Tjerkstra,Johan W. Berenschot,Henri Jansen,G.J. Burger,Johannes G.E. Gardeniers,Michael Curt Elwenspoek,A. van den Berg +7 more
TL;DR: In this paper, a new method for the fabrication of micro structures for fluidic applications, such as channels, cavities, and connector holes in the bulk of silicon wafers, called buried channel technology (BCT), is presented.
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Thick Co-based coating on cast iron by side laser cladding: Analysis of processing conditions and coating properties
TL;DR: In this article, the relationship between the relevant laser cladding parameters (i.e., laser beam scanning speed, laser power and powder feeding rate) and the main geometrical characteristics of a single laser track (height, width, dilution, etc.) were examined.