Michael Theurer

TL;DR: In this article, a hybrid InP to SiN TriPleX integration interface with a novel alignment technique and its application to complex photonic integrated circuits is presented, where vertical alignment stops are used to simplify the alignment process and allow for array integration with the same simplicity as for single dies.

TL;DR: A photonic-integrated circuit for continuous-wave (cw) terahertz (THz) generation is demonstrated by comprising two lasers and an optical phase modulator on a single chip, enabling the full control of the THz signal to be enabled via a unique bidirectional operation technique.

TL;DR: In this article, a DFB laser with electroabsorption modulators integrated on both sides of the DFB was used to provide two independently modulated optical outputs from a single laser source and thus cut the required number of chips for multilane applications in half.

TL;DR: In this article, an array of electroabsorption modulated lasers is proposed for high optical output power with semiconductor optical amplifiers at the front side of the chip for future 200 Gb/s transmitters.

TL;DR: In this article, an L-band InGaAlAs based electroabsorption modulated DFB laser integrated with a semiconductor optical amplifier is presented. But the authors focus on the influence of the integrated SOA on the device performance and present a DC and RF characterization.