F. M. Postma

TL;DR: In this article, a hybrid InP to SiN TriPleX integration interface with a novel alignment technique and its application to complex photonic integrated circuits is presented, where vertical alignment stops are used to simplify the alignment process and allow for array integration with the same simplicity as for single dies.

TL;DR: In this paper, the authors present an interface for hybrid flip-chip integration of InP-based laser sources to silicon-nitride-based photonic platforms, which enables efficient high optical power coupling over a wide temperature range.

TL;DR: In this paper, a design of electro-thermal bimorph actuators for alignment of flexible photonic waveguides fabricated in 16 µm thick SiO2 is presented.

Abstract: Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative - PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.