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Flip-Chip Integration of InP to SiN Photonic Integrated Circuits

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TLDR
In this article, a hybrid InP to SiN TriPleX integration interface with a novel alignment technique and its application to complex photonic integrated circuits is presented, where vertical alignment stops are used to simplify the alignment process and allow for array integration with the same simplicity as for single dies.
Abstract
We present our hybrid InP to SiN TriPleX integration interface with a novel alignment technique and its application to complex photonic integrated circuits. The integration interface comprises vertical alignment stops, which simplify the alignment process and allow for array integration with the same simplicity as for single dies. Horizontal alignment is carried out by utilizing optical backscatter reflectometry to get an active feedback signal without the need to operate the chip. Thus, typical contacting limitations of active flip-chip alignment are overcome. By using this method, we demonstrate the integration of InP DFB lasers with more than 60 mW of optical power coupled to a SiN waveguide with an averaged coupling loss of -2.1 dB. The hybrid integration process is demonstrated for single dies as well as full arrays. We evaluate the feasibility of the assembly process for complex photonic integrated circuits by integrating an InP gain chip to a SiN TriPleX external cavity. The process proves to be well suited and allows monitoring chip quality during assembly. A fully functional hybrid integrated tunable laser is fabricated, which is capable of full C-band tuning with optical output power of up to 60 mW.

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Journal ArticleDOI

Hybrid and heterogeneous photonic integration

TL;DR: This Tutorial provides an overview of the motivation behind the integration of different photonic and material platforms, and reviews common hybrid and heterogeneous integration methods and discusses the advantages and shortcomings.
Journal ArticleDOI

High-Power (>300 mW) On-Chip Laser With Passively Aligned Silicon-Nitride Waveguide DBR Cavity

TL;DR: In this article, the authors demonstrate a high-power on-chip 1550-nm laser implemented by passive flip-chip integration of a curved-channel, double-pass InGaAsP/InP slab-coupled optical waveguide amplifier (SCOWA) onto a photonic integrated circuit (PIC) containing a SiN waveguide and distributed Bragg reflector (DBR) grating.
Journal ArticleDOI

Hybrid dual-gain tunable integrated InP-Si 3 N 4 external cavity laser

TL;DR: In this article, a hybrid dual-gain integrated external cavity laser with full C-band wavelength tunability is presented, where two parallel reflective semiconductor optical amplifier gain channels are combined by a Y-branch in the Si3N4 photonic circuit to increase the optical gain.
Journal ArticleDOI

A Review of Capabilities and Scope for Hybrid Integration Offered by Silicon-Nitride-Based Photonic Integrated Circuits

TL;DR: In this article , the authors present some of the recent advances in the field of silicon nitride photonic integrated circuits, focusing on the material deposition techniques currently available, illustrating the capabilities of each technique and the functionalisation of the platform to achieve nonlinear processing, optical modulation, nonvolatile optical memories and integration with III-V materials to obtain lasing or gain capabilities.
References
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Journal ArticleDOI

Hybrid Integrated Platforms for Silicon Photonics

TL;DR: A review of recent progress in hybrid integrated platforms for silicon photonics is presented in this paper, where integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other using an organic bonding agent.
Book

Silicon Photonics: The State of the Art

TL;DR: Silicon Photonics: the State of the Art as mentioned in this paper provides an important and timely overview of the hot topics in the field, covering the various aspects of the technology that form the research area of silicon photonics.
Journal ArticleDOI

Heterogeneous Silicon Photonic Integrated Circuits

TL;DR: The impact active silicon photonic integrated circuits could have on interconnects, telecommunications, sensors, and silicon electronics is reviewed in this article, where the authors present a review of recent breakthroughs in the Silicon photonic technology and components.
Journal ArticleDOI

TriPleX: a versatile dielectric photonic platform

TL;DR: TriPleX as discussed by the authors is a dielectric waveguide platform based on alternating silicon nitride and silicon dioxide films, which can achieve low-loss waveguides over a wide wavelength range (400 nm-2.35 μm).
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