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Miguel Goni

Researcher at Boston University

Publications -  8
Citations -  338

Miguel Goni is an academic researcher from Boston University. The author has contributed to research in topics: Thermal conductivity & Particle. The author has an hindex of 3, co-authored 8 publications receiving 218 citations.

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Enhanced thermal transport across monolayer MoS2

TL;DR: In this paper, the authors used frequency domain thermoreflectance to study the crossplane thermal transport in mechanically exfoliated MoS2 samples supported on SiO2 and muscovite mica substrates.
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Thermal conductance of nanoscale Langmuir-Blodgett films

TL;DR: In this paper, the Langmuir-Blodgett (LB) technique was used to deposit nanometer-thick films of polyvinyl acetate (PVAc) on silicon and gold substrates in two distinct states: Liquid condensed (Lc) and Liquid expanded (Le).
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Frequency domain thermoreflectance technique for measuring the thermal conductivity of individual micro-particles.

TL;DR: An optical technique based on frequency domain thermoreflectance (FDTR) that is capable of measuring the thermal conductivity of individual particles a few microns across is presented and can provide values for a particle's effective volume which is new capability compared to conventional FDTR applied to multilayer samples.
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A technique to measure the thermal resistance at the interface between a micron size particle and its matrix in composite materials

Abstract: Particle-matrix interfaces can play an important role in heat propagation through particulate composites We investigated the possibility of using frequency domain thermoreflectance combined with a numerical thermal model to measure in situ the thermal resistance of the particle-matrix interface in particulate composite materials We found that the sensitivity of the technique depended on the matrix thermal conductivity, the particle size, and the value of the interface thermal resistance In general, high thermal conductivity matrix materials and small particles will present higher sensitivity to the interface thermal resistance We tested the technique with diamond particles embedded in tin and showed that the interface thermal resistance could be measured for these samples