M
Ming Li
Researcher at Shanghai Jiao Tong University
Publications - 383
Citations - 4768
Ming Li is an academic researcher from Shanghai Jiao Tong University. The author has contributed to research in topics: Copper & Intermetallic. The author has an hindex of 32, co-authored 364 publications receiving 3739 citations. Previous affiliations of Ming Li include Chinese Academy of Sciences.
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Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection
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Hydrothermal synthesis of porous copper microspheres towards efficient 4-nitrophenol reduction
TL;DR: In this article, a facile one-pot approach has been presented to synthesize porous Cu microspheres (PCMs) with diameters of 25μm.
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Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes
TL;DR: In this article, a novel application of arrays of nanocones prepared by a special electrodeposition method to improve the adhesion between the leadframe and epoxy molding compound (EMC) was reported.
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One-pot preparation of thin nanoporous copper foils with enhanced light absorption and SERS properties
TL;DR: A facile hydrothermal method has been presented to prepare free-standing nanoporous Cu foils (NPCFs) having a thickness of 1.4 μm and an area of up to 10 cm2, which were grown on the inwall of a Teflon-lined autoclave by assembling and reducing CuxO nanoparticle intermediates as mentioned in this paper.
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Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps
TL;DR: In this paper, the growth behavior of intermetallic compounds (IMCs) in Cu pillar solder bumps during high temperature aging were studied by microstructural observations and mathematical calculations, and based on experimental results and diffusion theory, formation mechanisms of IMCs in microbumps were proposed.