M
Ming Li
Researcher at Shanghai Jiao Tong University
Publications - 383
Citations - 4768
Ming Li is an academic researcher from Shanghai Jiao Tong University. The author has contributed to research in topics: Copper & Intermetallic. The author has an hindex of 32, co-authored 364 publications receiving 3739 citations. Previous affiliations of Ming Li include Chinese Academy of Sciences.
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Study on the behaviors of Cu filling in special through-silicon-vias by the simulation of electric field distribution
TL;DR: In this paper, the effects of additives in methanesulfonic solution are briefly studied by cyclic voltammetry to obtain the suitable copper plating condition for conventional TSV, and the electric field distribution in the special TSV during the electrodeposition has been simulated by the software ANSYS.
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Highly Conductive Cu Nanoneedle-Array Supported Silicon Film for High-Performance Lithium Ion Battery Anodes
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Facile synthesis of petal-like nanocrystalline Co3O4 film using direct high-temperature oxidation
TL;DR: In this paper, a petal-like cobalt oxide (PCO) structure has been fabricated by electrodeposition of the nanostructured Co film followed by elevated-temperature oxidation.
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Effects of amorphous CoW and NiW barrier layers on the evolution of Sn/Cu interface
TL;DR: In this paper, the barrier performance of electrodeposited Ni, Co, amorphous Ni W and Co W was studied. And the nanoindentation test indicated that the IMCs formed in Sn/Co-W/Cu sample were less sensitive to brittle fracture than Sn/Ni W/W/C sample, while the growth rates in the other three samples were limited by different diffusion species.
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Covalent Grafting of Tethered Homopolymer Film on p-Si(100).
Junhong Zhang,Ming Li +1 more
TL;DR: This polymerization method was one-step and cost-effective, and worked in the aqueous dispersed media containing both nitrobenzenediazonium tetrafluoroborate and methyl methacrylate (MMA) monomer.