M
Mordechai Rothschild
Researcher at Massachusetts Institute of Technology
Publications - 185
Citations - 3622
Mordechai Rothschild is an academic researcher from Massachusetts Institute of Technology. The author has contributed to research in topics: Photolithography & Lithography. The author has an hindex of 33, co-authored 181 publications receiving 3401 citations.
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Methods and apparatus employing an index matching medium
TL;DR: A perfluoropolyether (PFPE) index matching medium (120) as discussed by the authors was used with electromagnetic radiation (152) having a wavelength below 220nm, and it was used as an immersion fluid in an immersion lithographic system.
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Valleytronics: Opportunities, Challenges, and Paths Forward.
Steven A. Vitale,Daniel Nezich,Joseph O. Varghese,Philip Kim,Nuh Gedik,Pablo Jarillo-Herrero,Di Xiao,Mordechai Rothschild +7 more
TL;DR: The opportunities and challenges associated with manipulation of the valley degree of freedom for practical quantum and classical information processing applications were analyzed during the 2017 Workshop on Valleytronic Materials, Architectures, and Devices; this Review presents the major findings of the workshop.
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Effects of excimer laser irradiation on the transmission, index of refraction, and density of ultraviolet grade fused silica
TL;DR: In this paper, radiolytically induced UV absorption bands, an increase in index of refraction, and stress birefringence were observed in high purity fused silica during prolonged irradiation with a pulsed laser at 193 nm.
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Excimer-laser etching of diamond and hard carbon films by direct writing and optical projection
TL;DR: In this paper, the etching mechanism employs combined photochemical/thermal transformation of the initial crystal to graphite followed by sublimation or reaction of the transformed solid, achieving an etch rate of 2000 A/pulse.
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Lithography with 157 nm lasers
Theodore M. Bloomstein,Mark W. Horn,Mordechai Rothschild,Roderick R. Kunz,Stephen T. Palmacci,Russell B. Goodman +5 more
TL;DR: In this article, the authors studied the feasibility of projecting photolithography at 157 nm using a silylation resist process and a home-built, small-field, 0.5-numerical aperture stepper.