M
Muhannad S. Bakir
Researcher at Georgia Institute of Technology
Publications - 258
Citations - 3896
Muhannad S. Bakir is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Heat sink & Interposer. The author has an hindex of 30, co-authored 246 publications receiving 3524 citations. Previous affiliations of Muhannad S. Bakir include Georgia Tech Research Institute.
Papers
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Proceedings ArticleDOI
A 3D-IC Technology with Integrated Microchannel Cooling
D.C. Sekar,Calvin King,B. Dang,Todd J. Spencer,Hiren D. Thacker,Paul F. Joseph,Muhannad S. Bakir,James D. Meindl +7 more
TL;DR: A 3D-IC with integrated microchannel cooling is demonstrated in this article, where the demonstrated silicon die contain a through-silicon copper via density of 2500/cm2 integrated within the microchannel heat sink.
Book
Integrated Interconnect Technologies for 3D Nanoelectronic Systems
TL;DR: In this article, the authors present a broad overview of the latest advances in high-density compliant electrical interconnects, nanophotonics, and microfluidics for 3D GSI/TSI realization.
Proceedings ArticleDOI
Power Delivery for 3D Chip Stacks: Physical Modeling and Design Implication
TL;DR: In this article, an analytical physical model is derived to incorporate the impact of 3D-integration on power supply noise, such as inserting decap die and through-vias.
Journal ArticleDOI
Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips
TL;DR: In this article, the authors report the fabrication, assembly, and testing of a silicon chip with complementary metaloxide-semiconductor process compatible microchannel heat sink and thermofluidic chip input/output (I/O) interconnects fabricated using wafer-level batch processing.
Proceedings ArticleDOI
3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation
Muhannad S. Bakir,Calvin King,D.C. Sekar,Hiren D. Thacker,B. Dang,Gang Huang,Azad Naeemi,James D. Meindl +7 more
TL;DR: A novel 3D integration technology that enables the integration of electrical, optical, and microfluidic interconnects in a 3D die stack to enable stacking of high-performance (high-power) dice is described.