In today's highly demanding technological environment, one of the main challenges in new material design is combining seemingly irreconcilable thermomechanical properties in the same component (e.g., high heat and corrosion resistance, high strength in elevated-temperature applications and high resistance to wear, and high toughness in load-bearing elements). In many cases, the problem may be solved by using coatings or by layering dissimilar materials. From a structural viewpoint, a major disadvantage of these techniques, particularly in ceramic coating of metals, has been the resulting high thermal and residual stresses and relatively poor bonding strength. Thus, in thin films, coatings, and layered materials, surface cracking and debonding or delamination have been common forms of mechanical failure. One effective way of reducing residual and thermal stresses and enhancing bonding strength has been to eliminate material-property discontinuities by grading the material composition near the interfaces or through the coating. These new materials, with continuously varying compositions or volume fractions, are known as functionally graded materials (FGMs).In developing FGMs, research on the mechanics, and particularly on the fracture mechanics of these inhomogeneous materials, is needed to provide technical support to materials scientists and to manufacturing and design engineers. In the past, fracture mechanics has been useful both as a screening tool during material processing and as a design and maintenance tool for service-life assessment. Broadly speaking, fracture mechanics involves studying the effect of the applied loads, the component/flaw geometry, and the environmental conditions on the fracture of engineering materials.

Fracture Mechanics of Functionally Graded Materials

Parameter estimation for continuous-time models-A survey

Bioinspired engineering of honeycomb structure – Using nature to inspire human innovation

A system includes a semiconductor device. The semiconductor device includes a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layer. The second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands. Each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern.

System comprising a semiconductor device and structure

A device comprising semiconductor memories, the device comprising: a first layer and a second layer of layer-transferred mono-crystallized silicon, wherein the first layer comprises a first plurality of horizontally-oriented transistors; wherein the second layer comprises a second plurality of horizontally-oriented transistors; and wherein the second plurality of horizontally-oriented transistors overlays the first plurality of horizontally-oriented transistors.

Semiconductor device and structure

A 3D-IC technology with integrated microchannel cooling is demonstrated in this paper. Fluidic interconnect network fabrication proceeds at the wafer-level, is compatible with CMOS processing and flip-chip assembly and requires four lithography steps. Measurements for single chips prior to 3D stacking reveal that each die in a two chip 3D stack may potentially exhibit a junction-to-ambient thermal resistance of 0.24°C/W. The demonstrated silicon die contain a through-silicon copper via density of 2500/cm2 integrated within the microchannel heat sink.

A 3D-IC Technology with Integrated Microchannel Cooling

The plane elasticity problem for two bonded half planes containing a crack perpendicular to the interface was considered. The effect of very steep variations in the material properties near the diffusion plane on the singular behavior of the stresses and stress intensity factors were studied. The two materials were thus, assumed to have the shear moduli mu(o) and mu(o) exp (Beta x), x=0 being the diffusion plane. Of particular interest was the examination of the nature of stress singularity near a crack tip terminating at the interface where the shear modulus has a discontinuous derivative. The results show that, unlike the crack problem in piecewise homogeneous materials for which the singularity is of the form r/alpha, 0 less than alpha less than 1, in this problem the stresses have a standard square-root singularity regardless of the location of the crack tip. The nonhomogeneity constant Beta has, however, considerable influence on the stress intensity factors.

/pdf/the-crack-problem-in-bonded-nonhomogeneous-materials-3w8scxq96i.pdf

The crack problem in bonded nonhomogeneous materials

The order of stress singularities for bonded and disbonded three-material junctions

The fracture problem for a brittle matrix reinforced by ductile particles is considered. In the usual manner it is assumed that the crack surface bridging forces provided by the unbroken particles improve the fracture toughness of the matrix. Depending on the relative strength of the interfacial bonding between the matrix and the particles, two particle force models are introduced, namely, a force that is independent of the crack opening displacement (δ) and a force that is a highly non-linear function of δ. The problem is studied for a penny-shaped or plane strain crack in an infinite medium and for a surface crack in a semi-infinite medium under plane strain conditions. The toughness improvement in the matrix is shown to depend on a dimensionless bimaterial constant representing the inherent toughness of the matrix and the yield behavior of the particles. The effective toughness of the composite medium is calculated as a function of the crack size and the bimaterial constant.

Toughening of Ceramics through Crack Bridging by Ductile Particles

The mode 3 crack problem for two bonded homogeneous half planes was considered. The interfacial zone was modelled by a nonhomogeneous strip in such a way that the shear modulus is a continuous function throughout the composite medium and has discontinuous derivatives along the boundaries of the interfacial zone. The problem was formulated for cracks perpendicular to the nominal interface and was solved for various crack locations in and around the interfacial region. The asymptotic stress field near the tip of a crack terminating at an interface was examined and it was shown that, unlike the corresponding stress field in piecewise homogeneous materials, in this case the stresses have the standard square root singularity and their angular variation was identical to that of a crack in a homogeneous medium. With application to the subcritical crack growth process in mind, the results given include mostly the stress intensity factors for some typical crack geometries and various material combinations.

https://ntrs.nasa.gov/api/citations/19890014556/downloads/19890014556.pdf

Paul F. Joseph

Papers

A 3D-IC Technology with Integrated Microchannel Cooling

The crack problem in bonded nonhomogeneous materials

The order of stress singularities for bonded and disbonded three-material junctions

Toughening of Ceramics through Crack Bridging by Ductile Particles

The Mode III Crack Problem in Bonded Materials With a Nonhomogeneous Interfacial Zone