The science and technology of ultracapacitors are reviewed for a number of electrode materials, including carbon, mixed metal oxides, and conducting polymers. More work has been done using microporous carbons than with the other materials and most of the commercially available devices use carbon electrodes and an organic electrolytes. The energy density of these devices is 3¯5 Wh/kg with a power density of 300¯500 W/kg for high efficiency (90¯95%) charge/discharges. Projections of future developments using carbon indicate that energy densities of 10 Wh/kg or higher are likely with power densities of 1¯2 kW/kg. A key problem in the fabrication of these advanced devices is the bonding of the thin electrodes to a current collector such the contact resistance is less than 0.1 cm2. Special attention is given in the paper to comparing the power density characteristics of ultracapacitors and batteries. The comparisons should be made at the same charge/discharge efficiency.

Ultracapacitors: Why, How, and Where is the Technology

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

Classifications, applications, and design challenges of drones: A review

Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

MEMS Mechanical Sensors

Micro- and nano air vehicles are defined as “extremely small and ultra-lightweight air vehicle systems” with a maximum wingspan length of 15 cm and a weight less than 20 grams. Here, we provide a review of the current state of the art and identify the challenges of design and fabrication. Different configurations are evaluated, such as fixed wings, rotary wings, and flapping wings. The main advantages and drawbacks for each typology are identified and discussed. Special attention is given to rotary-wing vehicles (helicopter concept); including a review of their main structures, such as the airframe, energy storage, controls, and communications systems. In addition, a review of relevant sensors is also included. Examples of existing and future systems are also included. Micro- and nano-vehicles with rotary wings and rechargeable batteries are dominating. The flight times of current systems are typically around 1 hour or less due to the limited energy storage capabilities of the used rechargeable batteries. Fuel cells and ultra capacitors are promising alternative energy supply technologies for the future. Technology improvements, mainly based on micro- and nanotechnologies, are expected to continue in an evolutionary way to improve the capabilities of future micro- and nano air vehicles, giving improved flight times and payload capabilities.

/pdf/micro-and-nano-air-vehicles-state-of-the-art-4bdbqcldt3.pdf

Micro- and Nano-Air Vehicles: State of the Art

Anodic bonding of silicon wafers by sputter deposited glass films, silicon-to-silicon anodic bonding, is presented as a promising sealing method in microengineering. A reliable process for wafer-to-wafer bonding is described and data concerning yield and bonding strength are given. Cathodic bonding is reported in a discussion about the bonding mechanism. Different sputter deposited and annealed Pyrex 7740 layers are evaluated as sealing material. Some advantages of silicon-to-silicon anodic bonding as a mounting method for micromechanical sensors are quantified.

https://iopscience.iop.org/article/10.1088/0960-1317/1/3/002/pdf

Silicon-to-silicon anodic bonding with a borosilicate glass layer

An integrated capacitive pressure sensor with frequency-modulated output

Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors

The folded-waveguide slow-wave structure (SWS) is a robust beam-wave interaction circuit for millimeter-wave traveling-wave tubes. We applied a particle-in-cell solver (Computer Simulation Technology Particle Studio) to analyze and optimize a 220-GHz folded-waveguide SWS. The beam-wave interaction and the electron beam dynamics were studied based on simulation results. The influence of the beam tunnel, with respect to its transverse shape and size, on the circuit performance was investigated in detail. A beam tunnel with a square cross section exhibits lower gain and efficiency and similar bandwidth compared with a beam tunnel with a circular cross section. With a proper phase-velocity taper employed in the nonlinear region of the circuit, the small-signal gain, peak saturated output power, and efficiency were significantly improved, increasing from 21.5 to 27.8 dB, 41 to 70.5 W, and 4.5% to 8%, respectively, for a 36-mm-long loss-free circuit. A simulated 3-dB bandwidth of ~ 15 GHz is demonstrated.

Per Ohlckers

Papers

Micro- and Nano-Air Vehicles: State of the Art

Silicon-to-silicon anodic bonding with a borosilicate glass layer

An integrated capacitive pressure sensor with frequency-modulated output

Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors

Particle-in-Cell Simulation and Optimization for a 220-GHz Folded-Waveguide Traveling-Wave Tube