There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality.

Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

I and i

International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －

Apparatus including: an antenna configured for efficient far field communication at a first frequency; an inductive element including a plurality of series-connected coiled portions, including a first coiled portion and a second coiled portion, wherein the inductive element is configured to provide near field communication at a second frequency; and at least one reactive element parallel connected between the first coiled portion and the second coiled portion, wherein the at least one reactive element has a lower impedance at the first frequency than at the second frequency.

Near field communication

Energy scavenging for long-term deployable wireless sensor networks

Planar circuits for microwaves and lightwaves

Through-silicon vias (TSVs) in low, medium and high resistivity silicon for 3-D chip integration and interposers are modeled and thoroughly characterized from 100 MHz to 130 GHz, considering the slow-wave, dielectric quasi-TEM and skin-effect modes. The frequency ranges of these modes and their transitions are predicted using resistivity-frequency domain charts. The impact of the modes on signal integrity is quantified, and three coaxial TSV configurations are proposed to minimize this impact. Finally, conventional expressions for calculating the per-unit-length circuit parameters of transmission lines are extended and used to analytically capture the frequency dependent behavior of TSVs, considering the impact of the mixed dielectric (silicon dioxide-silicon-silicon dioxide) around the TSVs. Excellent correlation is obtained between the analytical calculations using the extended expressions and electromagnetic field simulations up to 130 GHz. These extended expressions can be implemented directly in electronic design automation tools to facilitate performance evaluation of TSVs, prior to system design.

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

In this paper, a simple but highly accurate high frequency model of induction machines for time and frequency domain simulation is presented. The proposed model enables exact simulation of both, differential and common mode behavior in the EMI-frequency range up to 30MHz. All parameters are easily obtained by differential and common mode impedance measurements and proposed calculation methodology. The model is verified for several induction machines in the power range of 370W up to 45kW. Comparison of simulation and measurement results confirm the good compromise between simulation time and accuracy even in complex simulation problems.

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Efficient HF modeling and model parameterization of induction machines for time and frequency domain simulations

In this paper, analytical, numerical-, and measurement-based methods for extracting the resistance, inductance, capacitance, and conductance of through silicon vias (TSVs) are classified, quantified, and compared from 100 MHz to 100 GHz. An in-depth analysis of the assumptions behind these methods is made, from which their limits of accuracy/validity are defined. Based on this, the most reliable methods within the studied frequency range are proposed. The TSVs are designed, fabricated, and measured. Very good correlation is obtained between electrical parameters of the TSVs extracted from the measurements and electromagnetic field simulations.

Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

From the EMC point of view, the integration of electric drive systems into today's cars represents a substantial challenge. The electric drive system is a new component consisting of a high-voltage power source, a frequency converter, an electric motor and shielded or unshielded high-power cables. Treating this new electric drive system or its components as a conventional automotive component in terms of EMI test procedures and emission limits would lead to substantial incompatibility problems. In this paper, the EMC issues related to the integration of an electric drive system into a conventional passenger car are investigated. The components of the drive system have been analyzed being either noise sources or part of the coupling path within the new electrical system of the car. The obtained results can also be used to determine the acceptable noise levels on a high voltage bus of an electric drive system.

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EMC issues in cars with electric drives

In high power density inverters with integrated functions like filters and control electronics electromagnetic interaction between components becomes an important issue. Especially filters for electromagnetic interference are very sensitive to electromagnetic fields and therefore critical to design. Nevertheless only few guidelines for optimizing placement of filter components were published up to now. This paper introduces a simulation method for predicting stray fields of components and conducting structures, which is verified experimentally for different passive components and setups. The examples demonstrate a possibility of handling interaction problems

Stephan Guttowski

Papers

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Efficient HF modeling and model parameterization of induction machines for time and frequency domain simulations

Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

EMC issues in cars with electric drives

Simulating Electromagnetic Interactions in High Power Density Inverters