Subin Lee

TL;DR: In this article, a planar flexible antenna for wireless local area network (WLAN) using simple microfabrication techniques that are compatible with existing state-of-the-art flexible electronic devices is presented.

TL;DR: In this paper, a twisted-pair design integrated into thin-film serpentine microstructure was proposed to minimize electromagnetic interference, such that the line's performance is minimally affected by the environment in close proximity, allowing its use in thinfilm bioelectronics, such as the epidermal electronic system.

TL;DR: In this article, a bio-compatible ultra-thin parylene-c is fabricated on a thin polyimide substrate with a thickness of 127 μm, which is suitable for integration with flexible electronic devices.

TL;DR: In this article, a low temperature III-V and Ge layer stacking process using wafer bonding and epitaxial lift-off was developed to solve the processing temperature limit for top side devices in order to ensure proper performance of bottom side devices.

TL;DR: In this article, a general approach for matching arbitrary MOSFETs with various ferroelectric (FE) materials was presented for the first time, in which the desired operation conditions were received for specific structures and materials, and with respect to the base structure, certain types of FEs are more preferable to obtain the sub-kT/q operation in a non-hysteretic manner for the wide band of applied voltages.