T
Takayuki Takahagi
Researcher at Hiroshima University
Publications - 129
Citations - 2865
Takayuki Takahagi is an academic researcher from Hiroshima University. The author has contributed to research in topics: X-ray photoelectron spectroscopy & Wafer. The author has an hindex of 27, co-authored 129 publications receiving 2779 citations.
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The formation of hydrogen passivated silicon single‐crystal surfaces using ultraviolet cleaning and HF etching
TL;DR: In this paper, the clean surface of a silicon single crystal was prepared with ultraviolet cleaning followed by HF dipping with low concentration HF obtained by dilution by organic free ultrapure water, at room temperature under the atmospheric condition.
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Ordered Two-Dimensional Nanowire Array Formation Using Self-Organized Nanoholes of Anodically Oxidized Aluminum
TL;DR: In this article, a two-dimensional ordered array of Au free standing nanowires was successfully fabricated by the deposition of Au using DC electroplating in nanoholes of aluminum oxide, by removal of the aluminum oxide barrier layer using wet chemical etching.
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XPS analysis of NH3 plasma‐treated polystyrene films utilizing gas phase chemical modification
Youichi Nakayama,Takayuki Takahagi,Fusami Soeda,Kenji Hatada,Shoji Nagaoka,Jirou Suzuki,Akira Ishitani +6 more
TL;DR: In this article, gas phase chemical modification (GCM) was applied to correlate the surface composition of NH3 plasma-treated polystyrene films with their cell-affinity, and the amount of primary-amine and that of carboxylic acid were directly determined by GCM.
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Self-organization of a porous alumina nanohole array using a sulfuric/oxalic acid mixture as electrolyte
TL;DR: The possibility of fabricating a highly regular nanohole array using different acid mixtures for the anodic oxidation of aluminum was investigated in this paper, where a 1:1 sulfuric/oxalic acid mixture was quantified.
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Bottom-Up Fill of Copper in Deep Submicrometer Holes by Electroless Plating
Shoso Shingubara,Zengling Wang,Osamu Yaegashi,Ryo Obata,Hiroyuki A. Sakaue,Takayuki Takahagi +5 more
TL;DR: In this paper, the authors investigated the effect of addition of inhibitor molecules to electroless Cu plating solution, and found that sulfopropyl sulfonate ~SPS! was highly effective in promoting the bottom-up fill.