Theodore Reck

TL;DR: In this paper, the electromagnetic design and characterization of a micromachined sub-millimeter-wave on-wafer probe is presented, and two designs based on different transmission line topologies are implemented and their performance assessed.

TL;DR: In this article, an eight-pixel transceiver array for operation in a 340 GHz imaging radar is presented, where Silicon micromachining is applied to fabricate the submillimeter-wave front-end components to increase the density and uniformity of the array while lowering the cost compared to metal machining.

TL;DR: In this article, a micromechanical compression pin is developed to improve wafer-to-wafer alignment to less than 1 μm, where the connection between the silicon waveguide and the VNA is aligned through a silicon boss that inserts into the custom waveguide flange.

TL;DR: The quantum capacitance detector as discussed by the authors is a superconducting device adapted from quantum computing applications in which photon-produced free electrons in a superconductor tunnel into a small capacitive island embedded in a resonant circuit.

TL;DR: SuperSpec as discussed by the authors is an ultra-compact spectrometer-on-a-chip for millimeter and submillimeter wavelength astronomy, which consists of a horn-coupled microstrip feedline, a bank of narrow-band superconducting resonator filters that provide spectral selectivity, and kinetic inductance detectors (KIDs) that detect the power admitted by each filter resonator.