Physical Review B

Journal of Scientific Instruments Editor: Dr H R Lang Vol 28 and Supplement No 1, 1951 Pp xvi + 388 + iii + 80 (London: Institute of Physics, 1951) Bound, £3 12s; unbound, £3

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A Review of Scientific Instruments

A system includes a semiconductor device. The semiconductor device includes a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layer. The second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands. Each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern.

System comprising a semiconductor device and structure

A device comprising semiconductor memories, the device comprising: a first layer and a second layer of layer-transferred mono-crystallized silicon, wherein the first layer comprises a first plurality of horizontally-oriented transistors; wherein the second layer comprises a second plurality of horizontally-oriented transistors; and wherein the second plurality of horizontally-oriented transistors overlays the first plurality of horizontally-oriented transistors.

Semiconductor device and structure

A method to process an Integrated Circuit device including processing a first layer of first transistors, then processing a first metal layer overlaying the first transistors and providing at least one connection to the first transistors, then processing a second metal layer overlaying the first metal layer, then processing a second layer of second transistors overlaying the second metal layer, wherein the second metal layer is connected to provide power to at least one of the second transistors.

Method for fabrication of a semiconductor device and structure

Prognostics is an engineering discipline that focuses on estimation of the health state of a component and the prediction of its remaining useful life (RUL) before failure. Health state estimation is based on actual conditions and it is fundamental for the prediction of RUL under anticipated future usage. Failure of electronic devices is of great concern as future aircraft will see an increase of electronics to drive and control safety-critical equipment throughout the aircraft. Therefore, development of prognostics solutions for electronics is of key importance. This paper presents an accelerated aging system for gate-controlled power transistors. This system allows for the understanding of the effects of failure mechanisms, and the identification of leading indicators of failure which are essential in the development of physics-based degradation models and RUL prediction. In particular, this system isolates electrical overstress from thermal overstress. Also, this system allows for a precise control of internal temperatures, enabling the exploration of intrinsic failure mechanisms not related to the device packaging. By controlling the temperature within safe operation levels of the device, accelerated aging is induced by electrical overstress only, avoiding the generation of thermal cycles. The temperature is controlled by active thermal-electric units. Several electrical and thermal signals are measured in-situ and recorded for further analysis in the identification of leading indicators of failures. This system, therefore, provides a unique capability in the exploration of different failure mechanisms and the identification of precursors of failure that can be used to provide a health management solution for electronic devices.

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Accelerated aging system for prognostics of power semiconductor devices

This paper presents a new design concept for the control of the holding voltage of LVTSCR ESD protection structures by realizing a negative feedback in the p emitter. The negative feedback is implemented by the creation of a voltage drop using embedded circuit elements. The final clamp voltage is tuned to exceed the power supply level, thus eliminating the potential for latchup. The design is validated by ESD pulse measurements performed on test structures with cascoded, triggered LVTSCRs for 5.5-V tolerant I/O pins in an 0.18-/spl mu/m CMOS process. The results of the first part of the study were used to propose another design for the LVTSCR with a high holding voltage based on emitter area reduction. The proposed device is validated using three-dimensional simulations and experimental analysis.

High holding voltage cascoded LVTSCR structures for 5.5-V tolerant ESD protection clamps

Power electronics play an increasingly important role in energy applications as part of their power converter circuits. Understanding the behavior of these devices, especially their failure modes as they age with nominal usage or sudden fault development is critical in ensuring efficiency. In this paper, a prognostics based health management of power MOSFETs undergoing accelerated aging through electrical overstress at the gate area is presented. Details of the accelerated aging methodology, modeling of the degradation process of the device and prognostics algorithm for prediction of the future state of health of the device are presented. Experiments with multiple devices demonstrate the performance of the model and the prognostics algorithm as well as the scope of application.

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Accelerated aging with electrical overstress and prognostics for power MOSFETs

A synchronous clock signal is generated in a large number of local clock circuits at the same time by exposing photoconductive regions in each local clock circuit to a pulsed light source that operates at a fixed frequency. The photoconductive regions generate photoconductive currents which are sufficient to cause a logic inverter to switch states.

Laser powered clock circuit with a substantially reduced clock skew

This paper demonstrates how to apply prognostics to power MOSFETs (metal oxide field effect transistor). The methodology uses thermal cycling to age devices and Gaussian process regression to perform prognostics. The approach is validated with experiments on 100V power MOSFETs. The failure mechanism for the stress conditions is determined to be die-attachment degradation. Change in ON-state resistance is used as a precursor of failure due to its dependence on junction temperature. The experimental data is augmented with a finite element analysis simulation that is based on a two-transistor model. The simulation assists in the interpretation of the degradation phenomena and SOA (safe operation area) change.

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Vladislav Vashchenko

Papers

Accelerated aging system for prognostics of power semiconductor devices

High holding voltage cascoded LVTSCR structures for 5.5-V tolerant ESD protection clamps

Accelerated aging with electrical overstress and prognostics for power MOSFETs

Laser powered clock circuit with a substantially reduced clock skew

Prognostics of power MOSFET