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William D. Goodhue

Researcher at Massachusetts Institute of Technology

Publications -  61
Citations -  952

William D. Goodhue is an academic researcher from Massachusetts Institute of Technology. The author has contributed to research in topics: Quantum well & Etching (microfabrication). The author has an hindex of 19, co-authored 61 publications receiving 924 citations. Previous affiliations of William D. Goodhue include University of Massachusetts Amherst & University of Massachusetts Lowell.

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Patent

Net-shape ceramic processing for electronic devices and packages

TL;DR: In this paper, a method of producing electronic device packages is provided, consisting of the steps of shaping a package preform and heating the package pretrain in a nitrogen-containing atmoshpere to nitride the preform.
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GaN avalanche photodiodes grown by hydride vapor-phase epitaxy

TL;DR: Avalanche photodiodes have been demonstrated utilizing GaN grown by hydride vapor-phase epitaxy as discussed by the authors, and the external quantum efficiency at unity gain is measured to be 35%.
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AlGaAs-InGaAs slab-coupled optical waveguide lasers

TL;DR: In this paper, the slab-coupled optical waveguide laser (SCOWL) concept was extended to the AlGaAs-InGaas-GaAs material system.
Patent

Two-dimensional surface-emitting laser array

TL;DR: In this paper, an improved two-dimensional semiconductor surface-emitting laser array is described in which two intra-cavity internal reflecting surfaces are formed at a 45° angle to the plane of the active layer of the semiconductor laser so as to internally reflect light from each end of the SLS in a direction normal to the point of interest with a buried reflective mirror provided in the path of one of said reflections, so that to transmit reflected light back through the laser and out the top surface of the array.
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Dry etching induced damage on vertical sidewalls of GaAs channels

TL;DR: In this paper, the vertical sidewalls of narrow GaAs structures were investigated and it was found that saturation current depends on the dry etching conditions such as ion energy, etching species, and impurity redeposition.