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William J. Durand

Researcher at University of Texas at Austin

Publications -  23
Citations -  1866

William J. Durand is an academic researcher from University of Texas at Austin. The author has contributed to research in topics: Copolymer & Thin film. The author has an hindex of 14, co-authored 23 publications receiving 1635 citations. Previous affiliations of William J. Durand include Stanford University & University of Texas System.

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The importance of surface morphology in controlling the selectivity of polycrystalline copper for CO2 electroreduction

TL;DR: It is found that a copper nanoparticle covered electrode shows better selectivity towards hydrocarbons compared with the two other studied surfaces, an electropolished copper electrode and an argon sputtered copper electrode.
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Structure effects on the energetics of the electrochemical reduction of CO2 by copper surfaces

TL;DR: In this article, the effects of the nanostructure of the copper surface and compare the effect of the fcc(111, fcc (100) and fcc-211) facets of copper on the energetics of the electroreduction of CO 2.
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Polarity-switching top coats enable orientation of sub-10-nm block copolymer domains.

TL;DR: A water-soluble polymer is developed that can top-coat lamellaforming block copolymers and that transforms during thermal annealing into a neutral wetting layer that helps drive the formation of vertically oriented lamellae.
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Design of high‐χ block copolymers for lithography

TL;DR: In this article, the authors describe the design and synthesis of a series of lamella-forming, silicon-containing block copolymers (Si-BCPs) and evaluation of these materials as potential candidates for lithographic applications.
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Interfacial Design for Block Copolymer Thin Films

TL;DR: In this article, top coat design, coating, and optimization methodologies are introduced that facilitate the synthesis, application, and identification of neutral top coats for block copolymer (BP) thin films.