Zinc oxide is a unique material that exhibits semiconducting and piezoelectric dual properties. Using a solid–vapour phase thermal sublimation technique, nanocombs, nanorings, nanohelixes/nanosprings, nanobelts, nanowires and nanocages of ZnO have been synthesized under specific growth conditions. These unique nanostructures unambiguously demonstrate that ZnO probably has the richest family of nanostructures among all materials, both in structures and in properties. The nanostructures could have novel applications in optoelectronics, sensors, transducers and biomedical sciences. This article reviews the various nanostructures of ZnO grown by the solid–vapour phase technique and their corresponding growth mechanisms. The application of ZnO nanobelts as nanosensors, nanocantilevers, field effect transistors and nanoresonators is demonstrated.

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Zinc oxide nanostructures: growth, properties and applications

Rapid progress in the synthesis and processing of materials with structure on nanometer length scales has created a demand for greater scientific understanding of thermal transport in nanoscale devices, individual nanostructures, and nanostructured materials. This review emphasizes developments in experiment, theory, and computation that have occurred in the past ten years and summarizes the present status of the field. Interfaces between materials become increasingly important on small length scales. The thermal conductance of many solid–solid interfaces have been studied experimentally but the range of observed interface properties is much smaller than predicted by simple theory. Classical molecular dynamics simulations are emerging as a powerful tool for calculations of thermal conductance and phonon scattering, and may provide for a lively interplay of experiment and theory in the near term. Fundamental issues remain concerning the correct definitions of temperature in nonequilibrium nanoscale systems. Modern Si microelectronics are now firmly in the nanoscale regime—experiments have demonstrated that the close proximity of interfaces and the extremely small volume of heat dissipation strongly modifies thermal transport, thereby aggravating problems of thermal management. Microelectronic devices are too large to yield to atomic-level simulation in the foreseeable future and, therefore, calculations of thermal transport must rely on solutions of the Boltzmann transport equation; microscopic phonon scattering rates needed for predictive models are, even for Si, poorly known. Low-dimensional nanostructures, such as carbon nanotubes, are predicted to have novel transport properties; the first quantitative experiments of the thermal conductivity of nanotubes have recently been achieved using microfabricated measurement systems. Nanoscale porosity decreases the permittivity of amorphous dielectrics but porosity also strongly decreases the thermal conductivity. The promise of improved thermoelectric materials and problems of thermal management of optoelectronic devices have stimulated extensive studies of semiconductor superlattices; agreement between experiment and theory is generally poor. Advances in measurement methods, e.g., the 3ω method, time-domain thermoreflectance, sources of coherent phonons, microfabricated test structures, and the scanning thermal microscope, are enabling new capabilities for nanoscale thermal metrology.

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Nanoscale thermal transport

基礎講座 電気泳動(Electrophoresis)

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Numerical Heat Transfer And Fluid Flow

In this paper, recent progress of phase change memory (PCM) is reviewed. The electrical and thermal properties of phase change materials are surveyed with a focus on the scalability of the materials and their impact on device design. Innovations in the device structure, memory cell selector, and strategies for achieving multibit operation and 3-D, multilayer high-density memory arrays are described. The scaling properties of PCM are illustrated with recent experimental results using special device test structures and novel material synthesis. Factors affecting the reliability of PCM are discussed.

Phase Change Memory

Heat conduction in novel electronic films influences the performance and reliability of micromachined transistors, lasers, sensors, and actuators. This article reviews experimental and theoretical research on heat conduction in single-crystal semiconducting and superconducting films and superlattices, polycrystalline diamond films, and highly disordered organic and oxide films. The thermal properties of these films can differ dramatically from those of bulk samples owing to the dependence of the material structure and purity on film processing conditions and to the scattering of heat carriers at material boundaries. Predictions and data show that phonon scattering and transmission at boundaries strongly influence the thermal conductivities of single-crystal films and superlattices, although more work is needed to resolve the importance of strain-induced lattice defects. For polycrystalline films, phonon scattering on grain boundaries and associated defects causes the thermal conductivity to be strongly anisotropic and nonhomogeneous. For highly disordered films, preliminary studies have illustrated the influences of impurities on the volumetric heat capacity and, for the case of organic films, molecular orientation on the conductivity anisotropy. More work on disordered films needs to resolve the interplay among atomic-scale disorder, porosity, partial crystallinity, and molecular orientation.

https://nanoheat.stanford.edu/sites/default/files/publications/A39.pdf

Heat Conduction in Novel Electronic Films

The electrocaloric effect offers an attractive alternative to the Peltier effect for compact high-efficiency solid-state refrigeration. We report an implementation and experimental characterization of a continuous electrocaloric refrigeration cycle where we use switchable liquid-based thermal interfaces to achieve reliable high-contrast thermal switching between an electrocaloric material and a heat source/sink. The experimentally measured temporal temperature profiles of a cooling load agree well with transient heat transfer modeling results. Our work experimentally validates the feasibility of electrocaloric refrigeration and motivates further applied research on device development.

A solid-state refrigerator based on the electrocaloric effect

The temperature rise in sub-micrometer silicon devices is predicted at present by solving the heat diffusion equation based on the Fourier law. The accuracy of this approach needs to be carefully examined for semiconductor devices in which the channel length is comparable with or smaller than the phonon mean free path. The phonon mean free path in silicon at room temperature is near 300 nm and exceeds the channel length of contemporary transistors. This work numerically integrates the two-dimensional phonon Boltzmann transport equation (BTE) within the silicon region of a silicon-on-insulator (SOI) transistor. The BTE is solved together with the classical heat diffusion equation in the silicon dioxide layer beneath the transistor. The predicted peak temperature rise is nearly 160 percent larger than a prediction using the heat diffusion equation for the entire domain. The disparity results both from phonon-boundary scattering and from the small dimensions of the region of strongest electron-phonon energy transfer. This work clearly shows the importance of sub-continuum heat conduction in modern transistors and will facilitate the development of simpler calculation strategies, which are appropriate for commercial device simulators.

https://nanoheat.stanford.edu/sites/default/files/publications/A43.pdf

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

We report the fabrication of dense arrays of super-hydrophilic Cu microposts at solid fractions as high as 58% and aspect ratios as high as four using electrochemical deposition and chemical oxidation techniques. Oxygen surface plasma treatments of photoresist molds and a precise control of the initial electrodeposition current are found to be critical in creating arrays of nearly defect-free Cu posts. The capillary performance of the micropost arrays is characterized using capillary rate of rise experiments and numerical simulations that account for the finite curvatures of liquid menisci. For the given wick morphology, the capillary performance generally decreases with increasing solid fraction and is enhanced by almost an order of magnitude when thin nanostructured copper oxide layers are formed on the post surface. The present work provides a useful starting point to achieve optimal balance between the capillary performance and the effective thermal conductivity of advanced wicks for micro heat pipes.

Fabrication and Characterization of the Capillary Performance of Superhydrophilic Cu Micropost Arrays

A comparative study of oxidation methods to create Cu surfaces with controlled wettability is reported. Micro/nanostructures of Cu oxides are formed on Cu substrates using different chemical and thermal oxidation methods. The morphology and wetting characteristics of the resulting surfaces are characterized using atomic force microscopy, scanning electron microscopy, X-ray diffraction, and contact angle measurements. Chemical oxidation in alkali solutions can form uniform copper oxide layers with high roughness factors without causing thermal stress problems that often hamper thermal oxidation. By combining chemical oxidation with a hydrophobic coating, a wide range of wettability control is demonstrated from superhydrophilic (  170°). Superhydrophilic CuO layers uniformly formed on Cu powder and Cu micropost wick surfaces lead to significant improvement in the capillary and heat transfer performance compared with comparable unoxidized Cu wicks. The present work motivates f...

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Y. Sungtaek Ju

Papers

Heat Conduction in Novel Electronic Films

A solid-state refrigerator based on the electrocaloric effect

Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors

Fabrication and Characterization of the Capillary Performance of Superhydrophilic Cu Micropost Arrays

A comparative study of the morphology and wetting characteristics of micro/nanostructured Cu surfaces for phase change heat transfer applications