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Zao Liu

Researcher at University of California, Riverside

Publications -  14
Citations -  227

Zao Liu is an academic researcher from University of California, Riverside. The author has contributed to research in topics: Piecewise linear function & Speedup. The author has an hindex of 10, co-authored 14 publications receiving 196 citations. Previous affiliations of Zao Liu include Xilinx.

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Task Migrations for Distributed Thermal Management Considering Transient Effects

TL;DR: A new temperature metric derived from frequency domain moment matching technique incorporates both initial temperature and other transient effects to make optimized task migration decisions, which leads to more effective reduction of hot spots in the experiments on a 100-core microprocessor than the existing distributed thermal management methods.
Journal ArticleDOI

Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

TL;DR: Experimental results show that the improved TSV thermal model (with proposed lateral thermal model) could greatly improve the accuracy of FD method in thermal simulation comparing with the existing method.
Journal ArticleDOI

Compact thermal modeling for packaged microprocessor design with practical power maps

TL;DR: A new behavioral thermal modeling technique for high-performance microprocessors at package level that applies the subspace identification method with the consideration of practical power maps with correlated power signals and proposes a piecewise linear (PWL) scheme to deal with nonlinear effects.
Proceedings ArticleDOI

Dynamic thermal management for multi-core microprocessors considering transient thermal effects

TL;DR: Experimental results demonstrate that the proposed thermal management scheme can reduce the number of the hot spots by 50% compared to the simple lowest temperature based task scheduling method, leading to more uniform on-chip temperature distribution across the microprocessor cores.
Proceedings ArticleDOI

Full-chip thermal analysis of 3D ICs with liquid cooling by GPU-accelerated GMRES method

TL;DR: This paper proposes an efficient finite difference based full-chip simulation algorithm for 3D-ICs using the GMRES method based on CPU platforms and develops a preconditioned GPU-accelerated GMRES solver, GPU-GMRES, to solve the resulting thermal equations on top of some published sparse numerical routines.