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8-Meth-oxy-3-methyl-3,4-di-hydro-2H-1,3-benzoxazine.

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TLDR
The title compound, C10H13NO2, crystallizes with two crystallographically independent molecules of similar geometry in the asymmetric unit; the six-membered oxazine rings adopts a half-chair conformation.
Abstract
The title compound, C10H13NO2, crystallizes with two crystallographically independent mol­ecules of similar geometry in the asymmetric unit; the six-membered oxazine rings adopts a half-chair conformation. Neither hydrogen bonds nor π–π inter­actions are observed in the crystal structure.

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Journal ArticleDOI

A short history of SHELX

TL;DR: This paper could serve as a general literature citation when one or more of the open-source SH ELX programs (and the Bruker AXS version SHELXTL) are employed in the course of a crystal-structure determination.
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OLEX2: a complete structure solution, refinement and analysis program

TL;DR: OLEX2 seamlessly links all aspects of the structure solution, refinement and publication process and presents them in a single workflow-driven package, with the ultimate goal of producing an application which will be useful to both chemists and crystallographers.
Journal ArticleDOI

General definition of ring puckering coordinates

TL;DR: In this article, a unique mean plane is defined for a general monocyclic puckered ring, which is described by amplitude and phase coordinates which are generalizations of those introduced for cyclopentane by Kilpatrick, Pitzer, and Spitzer.
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Phenolic materials via ring‐opening polymerization: Synthesis and characterization of bisphenol‐A based benzoxazines and their polymers

TL;DR: In this paper, the synthesis, composition, and structural analysis of precursors based on bisphenol-A are discussed, and the materials thus obtained exhibit excellent mechanical integrity with glass transition temperatures over 200°C.
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Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins

TL;DR: In this paper, the ternary mixture of benzoxazine, epoxy, and phenolic novolac resins is used for underfilling encapsulation and other highly filled systems.
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