Journal ArticleDOI
A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies
F. Sarvar,Paul Conway +1 more
TLDR
In this article, the authors describe the development of representative process models of the reflow soldering of printed circuit assemblies (PCAs) and outline some of the more important parameters to consider.About:
This article is published in Finite Elements in Analysis and Design.The article was published on 1998-07-15. It has received 18 citations till now. The article focuses on the topics: Reflow oven & Reflow soldering.read more
Citations
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Journal ArticleDOI
Bioinspired sweating with temperature sensitive hydrogel to passively dissipate heat from high-end wearable electronics
TL;DR: In this article, temperature-sensitive poly (N-isopropylacrylamide) (PNIPA) hydrogel is used to dissipate heat for high-heat-flux thermal management (1555.5 W/m2) of uneven hotspots in virtual reality (VR) device by mimicking the phenomenon of biological sweating.
Journal ArticleDOI
Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study
TL;DR: The evaluation results show that all three methods provide satisfactory soldering performance in terms of the process capability, sigma level, and process window indices (PWIs).
Journal ArticleDOI
Optimization of a reflow soldering process based on the heating factor
Jingang Gao,Yiping Wu,Han Ding +2 more
TL;DR: In this paper, the authors established a method to optimize reflow profiles and achieve high reliability of solder joints on the basis of the heating factor, Qη, a measure of the reflow profile related to reliability of reflow processed products.
Journal ArticleDOI
Modeling and optimization of reflow thermal profiling operation: a comparative study
TL;DR: In this paper, a comparative study of optimizing the reflow thermal profiling parameters using a hybrid artificial intelligence and the desirability function approaches without/with combining multiple performance characteristics into a single desireability is presented.
Journal ArticleDOI
Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement
TL;DR: In this article, the authors study the thermal warpage of a plastic ball grid array (PBGA) mounted on a printed circuit board (PCB) during the reflow process.
References
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Journal ArticleDOI
PCB glass-fibre laminates: thermal conductivity measurements and their effect on simulation
TL;DR: In this paper, the results of measurements carried out to determine the thermal conductivity along and normal to the plane of fiber glass laminates used in the manufacture of printed circuit boards are presented.
Journal ArticleDOI
A Detailed Thermal Model of the Infrared Reflow Soldering Process
Proceedings ArticleDOI
Process variables in the reflow soldering of surface mount
TL;DR: In this article, the authors attempt to relate the design and process variables to their effects on final joint quality and production process stability, and point out that the migration of manufacturers from vapor phase to infrared (IR) reflow soldering has gone some way to reduce the occurrences of many of the soldering defects however, despite the improvement provided with the IR reflow technique, any gains in reducing the number of occurrences per joint of these defects will to a large extent be counteracted by the significant increase in interconnections expected in the near future.
Proceedings ArticleDOI
Effective transient process modelling of the reflow soldering of printed circuit assemblies
F. Sarvar,Paul Conway +1 more
TL;DR: In this article, the authors describe the development of representative process models of the reflow soldering of printed circuit assemblies and outline some of the more important parameters to consider for accurate simulation of reflow process.
Journal ArticleDOI
Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen Injection
TL;DR: In this paper, a process oven with porous panel heaters is used to simulate a reflow soldering with nitrogen injection, where the injected gas is introduced selectively through top or bottom infrared heaters in order to dampen temperature fluctuations which can be established by thermal buoyancy forces in the oven gas.