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Proceedings ArticleDOI

An investigation of a new generation of progressive mask defects on the pattern side of advanced photomasks

TLDR
In this paper, a new generation of growing defects is introduced: crystals that grow on the half-tone (MoSi) film or on the chrome film, on the pattern side of the mask.
Abstract
Progressive mask defect problems such as crystal growth or haze are key yield limiters at DUV lithography, especially in 300mm fabs. With the high energy photons involved in DUV lithography and large wafer size requiring longer continuous exposure of masks, chances of photochemical reaction increases significantly on the masks. Most of the work published on this subject so far has been focused on defect growth on clear area (on the pattern surface) and on the back-glass of the mask. But there is a new generation of growing defects: crystals that grow on the half-tone (MoSi) film or on the chrome film, on the pattern side of the mask. It is believed that the formation mechanisms and rates are different for these new types of crystals. In light of this instability of masks in volume production, it becomes more important to understand the nature of such defects. The purpose of this investigation is to characterize the nature of these new defect growths and to understand the possible formation mechanisms involved in such problems.

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Citations
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Proceedings ArticleDOI

Novel cleaning techniques to achieve defect-free photomasks for sub-65-nm nodes

TL;DR: In this paper, the authors proposed a smart cleaning strategy to achieve the defect-free photomasks as a concern of above current issue with a combination of well-known cleaning technology, such as using the collective effects of ozonated water (DIO3) for the alternative to conventional clean (SPM/SC1) and UV/O3 treatment for the control of sulfate concentration.
Proceedings ArticleDOI

Reticle haze control: global update and technology roadmap

TL;DR: This paper describes a successful approach to reticle haze control, outlines its critical elements and explains its limiting factors, and provides practical recommendations for lithography practitioners on haze control equipment selections and reticle management strategy development.
Proceedings ArticleDOI

A Study of Haze Generation as Thin Film Materials

TL;DR: In this article, the authors investigated the generation of haze in thin film materials using ion chromatography (IC) analysis, and evaluated the difference in haze generation on the thin film material.
Proceedings ArticleDOI

Influence of organic contamination on photomask performance

TL;DR: In this paper, the AUV5500 tool provides the possibility to investigate the effect of mask contaminants from transmission and reflection measurements in the spectral range 145nm to 270nm, and to clean the mask surface as well.
Proceedings ArticleDOI

Improving cost of ownership on KLA-Tencor wafer fab reticle inspections by implementing pixel migration via new STARlight2+ capability

TL;DR: KLA-Tencor has developed and introduced STARlight2+ (SL2+) to satisfy this need, which is available on all TeraScanHR and TeraFab models.
References
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Proceedings ArticleDOI

Investigation of reticle defect formation at DUV lithography

TL;DR: In this paper, an attenuated phase shift mask (attPSM) was periodically exposed on a 193 nm scanner and the relationship between the number of exposures (i.e., energy passed through the mask during exposures) versus defect growth was developed.
Proceedings ArticleDOI

Mask industry assessment: 2002

TL;DR: In this article, a survey was created with support from International SEMATECH (ISMT) and administered by SEMI North America to gather information about the mask industry as an objective assessment of its overall condition.
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