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Boundary value problems of heat conduction
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The article was published on 1968-01-01 and is currently open access. It has received 846 citations till now. The article focuses on the topics: Boundary value problem & Thermal conduction.read more
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Analytical solutions for one-dimensional contaminant ion transport through electro-kinetic barriers
TL;DR: In this paper, two analytical solutions are proposed to predict the contaminant ion transport in the electro-kinetic barrier, considering the bottom surface as a Cauchy boundary or a Drichlet boundary condition.
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Uncoupled thermoelastic problem of a functionally graded thermosensitive rectangular plate with convective heating
TL;DR: In this paper, an analytical solution of the heat conduction equation is obtained in the transform domain by developing an integral transform technique for convective-type boundary conditions, where Goodier displacement function and Boussinesq harmonic functions are used to obtain the displacement profile and its associated thermal stresses.
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An introduction to short-circiut diffusion phenomena: Finite steady state heat energy drains in planar slabs
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Effects of interfacial thermal resistance on surface cracking in a coating layer bonded to a substrate
TL;DR: In this article, the authors examined the effects of thermal contact resistance on thermal stresses in layered structures that are in contact and found that the presence of interfacial thermal resistance has a significant impact on the transport properties of bonded materials and heat transfer in the materials.
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SystemC-AMS Thermal Modeling for the Co-simulation of Functional and Extra-Functional Properties
TL;DR: By adopting the functional language SystemC-AMS (Analog Mixed Signal), this article proposes a method to enable thermal/power/functional co-simulation and results will show that the choice of System C-AMS is a winning strategy for building a simultaneous simulation of multiple functional and extra-functional properties of a system.