Patent
Connection terminal and substrate for mounting semiconductor having the same
TLDR
In this article, a connection terminal is obtained by sequentially forming an electroless nickel plated film 3, an electrophoresis-free palladium plated (EPSP) film 4 on a conductive terminal.Abstract:
PROBLEM TO BE SOLVED: To provide a connection terminal which is excellent in connection reliability in soldering and with which the achievement of wire bonding is not disturbed by heat treatment. SOLUTION: The connection terminal is obtained by sequentially forming an electroless nickel plated film 3, an electroless palladium plated film 4 and an electroless gold plated film 5 on a conductive terminal 2. The thickness of the electroless nickel plated film 3 is within a range of 0.1-0.5 μm. COPYRIGHT: (C)2007,JPO&INPITread more
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Transmission line for high performance radio frequency applications
TL;DR: In this paper, the authors describe a transmission line for high performance radio frequency (RF) applications, which can include a bonding layer configured to receive an RF signal, a barrier layer, a diffusion barrier layer and a conductive layer proximate to the diffusion barrier.
Patent
Electroless gold-plating method and electronic component
Masayuki Kiso,Seigo Kurosaka,Yukinori Oda,Toru Okada,Ayumi Okubo,阿弓 大久保,幸典 小田,亨 岡田,雅之 木曽,成吾 黒坂 +9 more
TL;DR: In this paper, the authors proposed a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which the electroless nickel plating, electroless palladium plating and electroless metal plating are deposited.
Patent
Electroless surface treatment plated layers of printed circuit board and method for preparing the same
TL;DR: An electroless surface treatment plated layer of a printed circuit board, a method for preparing the same, and printed circuit boards including the same is presented in this article. But the thickness of the nickel plated coating is specially minimized to 0.02 to 1 μm, thereby making it possible to form an optimized electroless Ni/Pd/Au surface treatment layer.
Patent
Pretreatment liquid for promoting starting of electroless palladium plating reaction, electroless plating method using the pretreatment liquid, connection terminal formed by the electroless plating method, and semiconductor package using the connection terminal and its manufacturing method
TL;DR: In this paper, a pretreatment liquid for promoting starting of electroless palladium plating reaction for forming a film of uniform thickness by suppressing non-formation of an electroless nickel plating alloy film or reduction in thickness was provided.
Patent
Connection terminal, and board for semiconductor chip mounting use arranged by use thereof
TL;DR: In this article, a connection terminal consisting of a terminal form of copper, an electroless nickel plating film 3 stacked on the terminal forms of copper and a substitution gold plating board was proposed to keep superior soldering connection reliability even after being left under an environment of 150°C for 1000 hours.
References
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Patent
Wire bonding terminal, manufacture thereof and manufacture of semiconductor mounting substrate using that wire bonding terminal
TL;DR: In this paper, the authors proposed a wire bonding terminal, which does not hinder the success of wire bonding even if a heating treatment is performed on the terminal, and a method of manufacturing a semiconductor mounting substrate using the wire-bonding terminal.
Patent
Plating structure of bonding part
TL;DR: In this paper, the Ni-B plating contg. 0.01 to 10% B is first formed at a thickness of 0.005 to 5 μm and then Au is plated in superposing thereon.