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Digital Photoelasticity: Advanced Techniques and Applications

TLDR
In this article, phase shifting, Polarization Stepping and Fourier Transform Methods are used for phase unwrapping and Optically Enhanced Tiling in digital photoelasticity.
Abstract
Transmission Photoelasticity.- Reflection Photoelasticity.- Digital Image Processing.- Fringe Multiplication.- Fringe Thinning and Fringe Clustering.- Phase Shifting, Polarization Stepping and Fourier Transform Methods.- Phase Unwrapping and Optically Enhanced Tiling in Digital Photoelasticity.- Colour Image Processing Techniques.- Evaluation of Contact Stress Parameters and Fracture Parameters.- Stress Separation Techniques.- Fusion of Digital Photoelasticity, Rapid Prototyping and Rapid Tooling Technologies.- Recent Developments and Future Trends.

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Book ChapterDOI

Automatic Stress Measurement by Integrating Photoelasticity and Spectrometry

TL;DR: In this paper, the transmissivity extremities theory of photoelasticity (TEToP) has been used for higher level stress measurement in low birefringence materials.

Separatio of isochromatics ad isocliics phasemaps for the photoelastic techique with use phase shiftig ad a large umber of high precisio images

TL;DR: In this paper, a phase-shifting method was proposed to find new equations for a novel phase shifting method in digital photoelasticity, where only the analyzer is rotated, and the other equations are deduced by applying a new numerical technique instead of the usual algebraic techniques.
Proceedings ArticleDOI

In-Plane Residual Stress and its Relationship to Dislocation Density in Polycrystalline (EFG) Silicon Sheet

TL;DR: In this article, the authors measured and correlated point-by-point residual stress and dislocation density in the same wafer, and the residual stress was obtained with a resolution of 150 mum using an infrared photoelastic techniques.
Proceedings ArticleDOI

Stress metrology for flat-panel displays G6 and bigger

TL;DR: In this article, a tool for measurement of the stress in Generation 6 flat panel Displays (G6 FPD) and larger by observing the distortion of image of the light emitting device pattern reflected in the substrate.
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