Patent
Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide
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TLDR
In this paper, a first wafer and the optical element form an optical relay which relays light between the discrete opto-electronic transducer and an optical waveguide and thereby forms an efficient optical coupling between the optical transducers and optical waveguides.Abstract:
A novel electro-opto-mechanical assembly is provided. The electro-opto-mechanical assembly comprising: a first wafer, the wafer having a top and bottom surface; at least one optical element disposed on one surface of the first wafer; at least one discrete opto-electronic transducer element disposed on the bottom surface of the first wafer and in optical communication with the optical element; and an optical waveguide; wherein the first wafer and the optical element form an optical relay which relays light between the discrete opto-electronic transducer and the optical waveguide and thereby forms an efficient optical coupling between the discrete opto-electronic transducer and the optical waveguide.read more
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Small-scale optoelectronic package
Richard J. Pommer,Charles B. Kuznia,Tri Q. Le,Richard T. Hagen,Ronald E. Reedy,James S. Cable,Donald J. Albares,Mark Miscione +7 more
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References
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Method of coplanar integration of semiconductor IC devices
TL;DR: In this paper, a high degree of wafer-scale integration of normally incompatible IC devices is achieved by providing a plurality of segments, each segment having thereon one or more circuits, circuit elements, sensors and/or I/O connections.
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Method for producing high speed integrated circuits
TL;DR: In this article, a high speed semiconductor interconnect system which contains a plurality of signal traces, each in a flexible printed circuit, and each adhesively sandwiched between or adjacent to a flexible ground circuit and a flexible power circuit is presented.
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Wafer scale optoelectronic package
TL;DR: In this article, a package and method for packaging optoelectronic or electronic components is provided in which multiple chip regions are packaged simultaneously prior to sectioning of the wafer into chips.
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Single in-line optical package
TL;DR: In this article, an optical packaging arrangement is disclosed which utilizes silicon technology and overmolding techniques to provide a single in-line package with completely passive alignment between the various optical components.
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Processes for lift-off of thin film materials and for the fabrication of three dimensional integrated circuits
TL;DR: In this paper, three-dimensional communication in an integrated circuit can be implemented via electromagnetic communication between emitters and detectors fabricated via the novel processes, and arrays of optical detectors can also be implemented to perform image processing with tremendous speed.