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Journal ArticleDOI

Electroless nickel plating to Bi-Te sintered alloy and its properties

H. Wada, +2 more
- 01 Jul 1990 - 
- Vol. 9, Iss: 7, pp 810-812
TLDR
In this article, homogeneous electroless nickel plating to sintered Bi-Te alloy was tested by the heat-shock test and it was shown to function as a barrier of the diffusion of impurities.
Abstract
In this letter homogeneous electroless nickel plating to sintered Bi-Te alloy was tested by the heat-shock test and it was shown to function as a barrier of the diffusion of impurities

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Citations
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Journal ArticleDOI

Preparation, thermoelectric properties and interface analysis of n-type graded material FeSi2/Bi2Te3

TL;DR: In this article, an n-type β-FeSi 2 /Bi 2 Te 3 thermoelectric materials have been prepared by dip coating procedure using Sn 95 Ag 5 as bridge material.
Journal ArticleDOI

Interfacial reactions in thermoelectric modules

TL;DR: In this paper, the authors discuss the structures of thermoelectric (TE) module and illustrate the inter-diffusions across the interface of constituent layers, showing that modular design holds a key factor to advance the TE technology.
Journal ArticleDOI

Effect of Surface Roughness and Electroless Ni–P Plating on the Bonding Strength of Bi–Te-based Thermoelectric Modules

TL;DR: In this paper, an electroless-plating of a nickel-phosphor thin film on surface-controlled thermoelectric elements was developed to significantly increase the bonding strength between Bi-Te materials and copper (Cu) electrodes.
Journal ArticleDOI

Enhanced thermoelectric properties of metal film on bismuth telluride-based materials

TL;DR: In this article, the influence of metal layers coated to p-type and n-type Bi 2 Te 3 on the interface characterization and thermoelectric property is studied using a RF magnetron sputtering.
Proceedings ArticleDOI

Mechanical Properties of the Interface between Nickel Contact and Extruded (Bi1-xSbx)2(Te1-ySey)3 Thermoelectric Materials

TL;DR: In this article, the mechanical properties of electroplated and electroless plated Ni contacts on n-type and p-type polycrystalline quaternary alloys were studied.
References
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Journal ArticleDOI

Grain Size Effect on the Figure of Merit of Sintered Solid Solutions Based on Bi2Te3

TL;DR: The dependence of the thermoelectric figure of merit Z on grain size in sintered 16% BiSe3-84% Bi2Te3 and 75% SbTe3-25% BiTe3 solid solutions is analyzed in this article.