Patent
Electrolytic copper plating solutions
Leon R. Barstad,James E. Rychwalski,Mark Lefebvre,Stephane Menard,James L. Martin,Robert A Schetty,Michael P. Toben +6 more
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TLDR
In this article, a copper electroplating composition with high aspect ratio and small diameter microvias is described. But the method for use of the compositions and products formed by the compositions is not described.Abstract:
The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.read more
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Electroplating bath composition and method of using
Ramanan V. Chebiam,Valery Dubin +1 more
TL;DR: In this paper, a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication is described. But this method is not suitable for the fabrication of interconnect structures in semiconductor devices.
Patent
Copper electrodeposition in microelectronics
TL;DR: An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features is presented in this article. But the method involves superfilling by rapid bottom-up deposition at a superfill speed by which Cu deposition in a vertical direction from the bottoms of the features to the top openings of features is substantially greater than Cu deposition on the side walls.
Patent
Polymeric composite including nanoparticle filler
TL;DR: In this article, a novel polymeric composite including a nanoparticle filler and a method for the production thereof is presented, where the filler is effectively employed in a polymer composite in which the advantages of the tubular nanoparticles filler are provided (e.g., reinforcement, flame retardant, chemical agent elution, etc.) with improved or equivalent mechanical performance of the composite.
Patent
Composition for metal electroplating comprising leveling agent
Michael Siemer,Cornelia Röger-Göpfert,Nicole Meier,Roman Benedikt Raether,Marco Arnold,Charlotte Emnet,Dieter Mayer,Alexander Flügel +7 more
TL;DR: In this paper, the authors define a composition comprising a source of metal ions and at least one additive comprising at least a polyaminoamide represented by formula (I) or derivatives of a polyamide of formula(I) obtainable by complete or partial protonation, N-quarternisation or acylation.
Patent
Cooper-plating solution, plating method and plating apparatus
TL;DR: In this article, a copper-plating solution is provided for a substrate having an seed layer and fine recesses of a high aspect ratio, which can reinforce the thin portion of the seed layer.
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Electro deposition chemistry
TL;DR: In this paper, the authors provide plating solutions, particularly metal plating solution, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features.
Patent
Pulse electroplating copper or copper alloys
TL;DR: In this article, high aspect ratio openings in excess of 3, via holes or contact holes, in a dielectric layer are voidlessly filled employing a pulse or forward-reverse pulse electroplating technique to deposit copper or a copper-base alloy.
Patent
Electrodeposition of copper from acid baths
TL;DR: A bath for electrodepositing ductile, lustrous copper which comprises an aqueous acidic copper plating bath containing dissolved therein a brightening amount of the reaction product of polyethyleneimine and an alkylating agent which will alkylate the nitrogen of the polyethylenimine to produce a quaternary nitrogen as mentioned in this paper.
Patent
Electrodeposition of bright copper
TL;DR: In this article, a method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating electrolyte particularly suited for plating electronic circuit boards containing a brightening and leveling amount of a system comprising a bath soluble substituted phthalocyanine radical, bath soluble adduct of a tertiary alkyl amine with polyepichlorohydrin, and bath soluble organic divalent sulfur compound.
Patent
Chemical mechanical polishing pad slurry distribution grooves
TL;DR: In this article, a chemical mechanical polishing pad has a neck region at the top of the groove, where the groove side walls are substantially parallel, which provides a margin for the pad to wear during polishing without affecting the pad's surface area.