Patent
Hybrid integrated circuit device
Akira Kazami,Osamu Nakamoto,Hisashi Shimizu,Katsumi Ohkawa,Yasuhiro Koike,Koji Nagahama,Masao Kaneko,Masakazu Ueno,Yasuo Saitou +8 more
Reads0
Chats0
TLDR
In this article, the authors presented a hybrid integrated circuit with an active filter, which is mounted on an insulating metal substrate and has a specific circuit structure wherein the substrate is divided by a ground pattern or power supply pattern into two blocks.Abstract:
Disclosed is a hybrid integrated circuit device provided with an active filter. The active filter is constructed mainly from a rectifier circuit, a reactor with one terminal connected with an output terminal of the rectifier, a switching element connected with one terminal of the reactor and a smoothing condenser connected with the other terminal of the reactor. The active filter is mounted on an insulating metal substrate and has, other than the above feature, a specific circuit structure wherein the substrate is divided by a ground pattern or power supply pattern into two blocks. One block is for a large current circuit such as the rectifier circuit, the switching element, and a diode and another block for a small signal circuit such as a control circuit. The hybrid integrated circuit device is of remarkably compact size. Also, it is greatly superior in a noise performance because switching noise does not flow into the chassis of electronic equipment from the metal substrate and the control circuit is shielded from the noise produced by the large current circuit, and also because the noise caused by wiring inductance can be limited.read more
Citations
More filters
Patent
Lighting device and lighting method
TL;DR: In this paper, a lighting device comprising first and second groups of solid state light emitters, which emit light having peak wavelength in ranges of from 430 nm to 480 nm, and the second and third groups of lumiphors which emit dominant wavelength in the range of from 555 nm to 585 nm.
Patent
Power surface mount light emitting die package
TL;DR: In this article, a light emitting die package includes a substrate, a reflector plate, and a lens, which can be raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip.
Patent
Power semiconductor device
TL;DR: In this paper, a gate electrode is disposed, through a gate insulating film, in a trench adjacent to the main cell, and a buffer resistor having an infinitely large resistance value is inserted between the buffer layer and emitter electrode.
Patent
LED illumination apparatus and card-type LED illumination source
TL;DR: In this article, a card-type LED illumination source is used to provide illumination for a metal base substrate and the multiple LEDs that have been mounted on one surface of the substrate.
Patent
Wafer level phosphor coating method and devices fabricated utilizing method
Ashay Chitnis,James Ibbetson,Arpan Chakraborty,Eric J. Tarsa,Bernd Keller,James Seruto,Yankun Fu +6 more
TL;DR: In this paper, a method for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate is described. But, the method is not suitable for the case of flip-chip bonding.
References
More filters
Patent
Light-radiating semiconductor component with a luminescence conversion element
Ulrike Reeh,Klaus Höhn,Norbert Stath,Günter Waitl,Peter Schlotter,Jürgen Schneider,Ralf Schmidt +6 more
TL;DR: In this article, a light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element, which converts a portion of the radiation into radiation of a longer wavelength.
Patent
Fabrication process of semiconductor package and semiconductor package
Naoki Fukutomi,Yoshiaki Tsubomatsu,Fumio Inoue,Toshio Yamazaki,Hirohito Ohhata,Shinsuke Hagiwara,Noriyuki Taguchi,Hiroshi Nomura +7 more
TL;DR: In this paper, a semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors, and a nickel layer is plated on an electroplated copper foil to form a wiring pattern.
Patent
Three dimensional integrated circuit package
TL;DR: In this article, a three-dimensional high density package for integrated circuits for which integrated circuits are placed onto substrate layers and then stacked together is described, and techniques for interconnecting the layers to one another and for connecting the layer to external circuitry are also disclosed.
Patent
Methods for manufacturing a semiconductor package having a sacrificial layer
TL;DR: In this article, a sacrificial layer is used as a base to selectively form an array of conductive pads such that a central region is defined by the pads, and a curable, dielectric liquid encapsulant is then deposited on the sacrificial layers such that the pads and electrical connections and chip are fully encapsulated, as by an overmolding operation.