Journal ArticleDOI
Kinetics of oxidation of copper at low temperatures under the influence of externally induced current flow
TLDR
In this article, the results for the accelerating field application are discussed with reference to Mott and Cabrera's parabolic equation for the thin film range, and the changes from logarithmic to parabolic law due to the application of current is probably due to a change in the mechanism of the process.About:
This article is published in Acta Metallurgica.The article was published on 1970-05-01. It has received 12 citations till now. The article focuses on the topics: Diffusion & Oxide.read more
Citations
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Journal ArticleDOI
Oxidation of copper in controlled clean air and standard laboratory air at 50°C to 150°C
TL;DR: In this article, the growth of the oxide film formed on copper at moderately low temperatures (150 to 50°C) in controlled clean air and typical laboratory air environments has been carried out.
Journal ArticleDOI
A critical appraisal of the logarithmic rate law in thin-film formation during oxidation of copper and its alloys
S. K. Roy,S. C. Sircar +1 more
TL;DR: In this paper, the authors investigated the kinetics of thin film formation of copper and its alloys in the temperature range of 75-100°C and found that the experimental results have been found to follow the logarithmic rate law except for the copper-chromium system at 100°C.
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Effect of yttrium on properties of copper prepared by powder metallurgy
TL;DR: In this paper, the performance and process conditions of samples prepared by hot-press forming were significantly superior to those of cold-press formulating, and the results indicated that the optimum preparation condition was: sintering temperature 800 Â Â c, Sintering time 3 Â h, pressure 30 Â MPa, Y-doping concentration 0.5 Â % for hot press forming and 0.1 Â percent for cold press forming.
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Influence of an Applied Field on the Tarnishing of Silver and Copper in Iodine Vapour
TL;DR: In this paper, an electric field was applied across the growing iodide layer by pressing a platinum mesh over the outer surface, to act as one electrode, the metal specimen being the other electrode.
References
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Journal ArticleDOI
Vacancies and other Point Defects in Metals and Alloys
TL;DR: In this article, it was shown that all μ-interactioI18 or electron-interactions a.re invariant for the transformations of the neutrino gauge.
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The rates of oxidation of several faces of a single crystal of copper as determined with elliptically polarized light
TL;DR: In this article, the rates of oxidation of the (100), (111), (110) and (311) faces of a copper single crystal were determined at the temperatures 70°, 106°, 130°, 159°, and 178°C by measuring the increase in thickness of the oxide film as a function of time.
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Effect of an Electric Field on Silicon Oxidation
TL;DR: The dependence of the oxidation rate on an electric field indicates that oxygen ions are the predominant species diffusing through the growing oxide film as mentioned in this paper, indicating that oxygen ion diffusion is controlled by the diffusion of oxygen through the silicon dioxide film.