Patent
Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths
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TLDR
In this paper, a burst of ultrashort laser pulses is employed to sever a conductive link in a nonthermal manner and offers a wider processing window, eliminates undesirable HAZ effects, and achieves superior severed link quality.Abstract:
A burst of ultrashort laser pulses is employed to sever a conductive link (22) in a nonthermal manner and offers a wider processing window, eliminates undesirable HAZ effects, and achieves superior severed link quality. The duration of the burst is preferably in the range of 10 ns to 500 ns; and the pulse width of each laser pulse within the burst is generally shorter than 25 ps, preferablyshorter than or equal to 10 ps, and most preferably about 10 ps to 100 fs or shorter. The burst can be treated as a single 'pulse' by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a burst of laser pulses at each link (22). Conventional wavelengths or their harmonics can be employed.read more
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References
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Method for controlling configuration of laser induced breakdown and ablation
Gerard Mourou,D. Du,Subrata Dutta,Victor M. Elner,Ron M. Kurtz,Paul R. Lichter,Xinbing Liu,P.P. Pronko,Jeff Squier +8 more
TL;DR: In this article, the authors proposed a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable change in slope at a predetermined laser pulse width value.
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