Patent
Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths
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TLDR
In this paper, a burst of ultrashort laser pulses is employed to sever a conductive link in a nonthermal manner and offers a wider processing window, eliminates undesirable HAZ effects, and achieves superior severed link quality.Abstract:
A burst of ultrashort laser pulses is employed to sever a conductive link (22) in a nonthermal manner and offers a wider processing window, eliminates undesirable HAZ effects, and achieves superior severed link quality. The duration of the burst is preferably in the range of 10 ns to 500 ns; and the pulse width of each laser pulse within the burst is generally shorter than 25 ps, preferablyshorter than or equal to 10 ps, and most preferably about 10 ps to 100 fs or shorter. The burst can be treated as a single 'pulse' by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a burst of laser pulses at each link (22). Conventional wavelengths or their harmonics can be employed.read more
Citations
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Laser-based system for memory link processing with picosecond lasers
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TL;DR: In this paper, a laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate.
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TL;DR: In this paper, a method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided.
References
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Ophthalmic surgery method using non-contact scanning laser
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