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Low-temperature activation of As in Hg 1-x Cd x Te(211) grown on Si by molecular beam epitaxy

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TLDR
In this article, the authors proposed to activate arsenic as a p-type dopant at temperatures sufficiently low that they will not compromise the integrity of p-n junctions and showed that the energy barrier for As transfer from Hg to Te sites can be overcome at 250°C.
Abstract
The HgCdTe infrared detectors and test structures based on dual or multicolor HgCdTe are desirable for various applications. It is important to control both pand n-type extrinsic doping in these photovoltaic structures. This paper addresses the issue of activating arsenic as a p-type dopant at temperatures sufficiently low that they will not compromise the integrity of p-n junctions. Midwavelength infrared (MWIR) HgCdTe epilayers were grown by molecular beam epitaxy (MBE) using an In-free type of mounting. The doping was performed by coevaporating arsenic from an elemental solid source during the growth. During postgrowth treatments, we employed a two-step annealing process. During both steps, we used temperatures (300°C, 275°C, and 250°C) that are well below the current standard annealing temperatures. The results suggest that the energy barrier for As transfer from Hg to Te sites can be overcome at 250°C; hence, p doping can be achieved at the temperature of 250°C. The temperature-dependent Hall effect characteristics of the grown samples were measured by the van der Pauw technique with magnetic fields up to 0.4 T.

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Progress, challenges, and opportunities for HgCdTe infrared materials and detectors

Abstract: This article presents a review on the current status, challenges, and potential future development opportunities for HgCdTe infrared materials and detectortechnology. A brief history of HgCdTe infrared technology is firstly summarized and discussed, leading to the conclusion that HgCdTe-based infrared detectors will continue to be a core infrared technology with expanded capabilities in the future due to a unique combination of its favourable properties. Recent progress and the current status of HgCdTe infrared technology are reviewed, including material growth,device architecture, device processing, surface passivation, and focal plane array applications. The further development of infrared applications requires that future infrared detectors have the features of lower cost, smaller pixel size, larger array format size, higher operating temperature, and multi-band detection, which presents a number of serious challenges to current HgCdTe-based infrared technology. The primary challenges include well controlled p-type doping, lower cost, larger array format size, higher operating temperature, multi-band detection, and advanced plasma dry etching. Various new concepts and technologies are proposed and discussed that have the potential to overcome the existing primary challenges that are inhibiting the development of next generation HgCdTeinfrared detectortechnology.
Journal ArticleDOI

Molecular beam epitaxy growth of high-quality arsenic-doped HgCdTe

TL;DR: In this article, a joint effort was initiated to better elucidate the fundamental mechanisms underlying As-doping in molecular beam epitaxy (MBE)-grown HgCdTe.
Journal ArticleDOI

Doping of epitaxial layers and heterostructures based on HgCdTe

TL;DR: In this article, the main changes in technology of HgCdTe doping, which occurred when device structures fabricated on the basis of bulk material were replaced by those based on epitaxial layers are analyzed.
Journal ArticleDOI

The bulk generation-recombination processes and the carrier lifetime in mid-wave infrared and long-wave infrared liquid nitrogen cooled HgCdTe alloys

Abstract: Comprehensive study of the bulk generation-recombination mechanisms and the carrier lifetime in long wavelength and mid wavelength infrared indium-doped as well as arsenic- and mercury vacancies-doped HgCdTe ternary alloys at liquid nitrogen temperature has been done. The excess minority carrier lifetime in HgCdTe materials has been calculated by solving the set of non-linear transport equations under conditions of small deviation from equilibrium. The results of numerical calculations of the carrier lifetime determined by the Auger 1, Auger 7, and Shockley-Read-Hall mechanisms related to mercury vacancies have been compared with experimental data available in the literature. We re-examine the carrier lifetime, including the impact of the electrical screening on Coulomb interaction of carriers in the Auger process to explain certain inconsistency between theoretical prediction and experimental data especially in highly doped p-type HgCdTe material. Moreover, the marginal significance of the interband radi...
References
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Journal ArticleDOI

Optically pumped LPE-grown Hg1−xCdxTe lasers

TL;DR: In this paper, liquid phase epitaxially-grown HgCdTe crystals were found to lase continuously at 2.79 Μm using a O-switched Nd:YAG laser.
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Infinite-melt vertical liquid-phase epitaxy of HgCdTe from Hg solution: Status and prospects

Tse Tung
TL;DR: In this article, the authors reviewed the current status as well as the evolution of one modification of LPE technology, specifically, "infinite-melt" vertical LPE (VLPE) from Hg-rich solutions.
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Diffusion in CdxHg1-xTe and related materials

TL;DR: In this article, self-diffusion and impurity diffusion in Cd x Hg 1-x Te and its parent binary compounds CdTe and HgTe are discussed and the available data are reviewed in detail.
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Electrical activity, mode of incorporation and distribution coefficient of group V elements in Hg 1- x Cd x grown from tellurium rich liquid phase epitaxial growth solutions

TL;DR: In this article, the authors reported that the activity coefficient of the group V elements in Te-rich liquid phase epitaxial solutions is probably orders of magnitude lower than it is in Hg-rich solutions.
Journal ArticleDOI

The behavior of doped Hg1−xCdxTe epitaxial layers grown from Hg-rich melts

TL;DR: In this article, the properties of Hg1-xCdxTe epitaxial layers grown from doped Hg-rich melts are examined, and the most promising dopants for this melt system are indium for n-type layers, and arsenic or antimony for p -type layers.
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