scispace - formally typeset
Journal ArticleDOI

Machining of sub-micron holes using a femtosecond laser at 800 nm

Reads0
Chats0
TLDR
In this article, a Ti:sapphire laser was used to ablate holes with a diameter of 300 nm and a depth of 52 nm to produce very small features in materials.
About
This article is published in Optics Communications.The article was published on 1995-01-15. It has received 457 citations till now. The article focuses on the topics: Laser beam machining & Laser ablation.

read more

Citations
More filters
Journal ArticleDOI

Femtosecond laser micromachining in transparent materials

TL;DR: In this article, the physical mechanisms and the main experimental parameters involved in femtosecond laser micromachining of transparent materials, and important emerging applications of the technology are described.
Book

Laser Material Processing

TL;DR: In this paper, the effect of reflectivity of the surface, when a pure, monochromatic laser (6) is used, is remedied by the simultaneous application of a relatively shorter wavelength beam (1).
Journal ArticleDOI

Laser ablation and micromachining with ultrashort laser pulses

TL;DR: In this paper, the mechanisms of ultrashort-pulse laser ablation of materials are discussed, and the differences to that of long laser pulses are emphasized, and some femtosecond laser pulse micromachining results, including comparison with long pulses, are presented.
Journal ArticleDOI

Ablation of metals by ultrashort laser pulses

TL;DR: In this paper, the authors studied the ablation of metal targets by Ti:sapphire laser radiation and showed that the intensity depends logarithmically on the laser fluence.
Journal ArticleDOI

Direct femtosecond laser surface nano/microstructuring and its applications

TL;DR: In this article, a new field of direct femtosecond laser surface nano/microstructuring and its applications is reviewed, where the authors present a review of the current state-of-the-art in this field.
References
More filters
Journal ArticleDOI

Laser‐induced breakdown by impact ionization in SiO2 with pulse widths from 7 ns to 150 fs

TL;DR: In this article, the results of laser-induced breakdown experiments in fused silica (SiO2) employing 150 fs −7 ns, 780 nm laser pulses are reported and the avalanche ionization mechanism is found to dominate over the entire pulse width range.
Journal ArticleDOI

Quintic-phase-limited, spatially uniform expansion and recompression of ultrashort optical pulses.

TL;DR: The system allows one to eliminate spatial inhomogeneities and cubic and quartic phase errors that make existing designs unsuitable for use with pulses much shorter than 100 fs, and is experimentally demonstrate >10,000 times expansion and recompression of ∼25-fs optical pulses.
Journal ArticleDOI

Multikilohertz Ti:Al 2 O 3 amplifier for high-power femtosecond pulses

TL;DR: This source was used to produce 1 W of femtosecond white light through spectral continuum generation and was amplified at repetition rates of as much as 7.2 kHz in a Ti:Al(2)O(3) regenerative amplifier pumped by a frequency-doubled Q-switched Nd:YLF laser.
Related Papers (5)