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Patent

Manufacture of thin film transistor

TLDR
In this paper, a thermal CVD of high-order silane such as trisilane or higher was used as a channel semiconductor film of a thin-film transistor.
Abstract
PURPOSE:To perform stable operation characterized by high mobility, by using a silicon film made by thermal CVD of high-order silane such as trisilane or higher as a channel semiconductor film of a thin film transistor. CONSTITUTION:On an insulating substrate 1, a gate 2 comprising Ni, W, Mo and the like is formed by evaporation, sputtering and the like. A gate insulating film 3 such as a silicon oxide film and silicon nitride film is laminated by a CVD method and the like on the gate 2. A silicon film 4 of high-order silane such as trisilane or higher is formed by a thermal CVD method on the film 3. A source 5 and a drain 6, which have doublelayer structure of a P-or N-type low resistance semiconductor film and a metal film, are formed. An inverted staggered type thin film transistor is formed. The silicon film 4 is formed as follows: the substrate is heated to a temperature of about 400 deg.C; the high order silane such as the trisilane or higher is introduced in a chamber 7; and the film 4 is formed on the surface of the substrate by thermal decomposition reaction on the substrate.

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Citations
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References
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Patent

Amorphous silicon thin film transistor and manufacture thereof

TL;DR: In this paper, a gate electrode is formed on a semiconductor layer through an insulation layer, and N layers are formed in parallel isolated from each other on a clean surface of the semiconductor.
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TL;DR: In this article, the authors proposed a method to form an amorphous silicon film at low temperature, by employing a silane gas of higher order as a material gas, and irradiating the gas with light having a wavelength 300nm or shorter.
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Formation of hydrogenated amorphous silicon film

TL;DR: In this paper, the authors propose to increase the growth speed of a hydrogenated amorphous silicon (a-Si-H) film and obtain a film having excellent heat resistance by decomposing thermally higher gaseous silane under atm pressure or above to deposit said film on a substrate.