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Method for treating a surface with a microwave or UHF plasma and improved apparatus

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TLDR
In this article, a method for etching or chemically treating a surface of an article utilizing a radio frequency wave ion generating apparatus which provides a thin disk shaped plasma is described, which can have a relatively large diameter (on the order of magnitude 50 centimeters).
Abstract
A method for etching or chemically treating a surface of an article utilizing a radio frequency wave ion generating apparatus which provides a thin disk shaped plasma is described. The plasma disks can have a relatively large diameter (on the order of magnitude 50 centimeters). The plasma disks can be created without using a static magnetic field. The radio frequency waves are preferably microwaves or UHF. The method is particularly useful for ion or free radical irradiation of the surface provided in the plasma or for irradiation of the surface by ions accelerated outside a cavity containing the plasma. Disk plasmas are created over a wide pressure range (10-4 Torr to 1 atmosphere) and are highly ionized at low pressures. An apparatus adapted for treating a surface of an article with ions from a plasma is also described. The method and apparatus are preferably used for treating a surface forming part of an integrated circuit.

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Citations
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References
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Journal ArticleDOI

Plasma etching—A discussion of mechanisms

TL;DR: In this paper, the etching process is discussed in terms of three basic steps: adsorption, product formation, and product desorption with the goal of clarifying the relative importance of these three steps.
PatentDOI

Microwave plasma etching

TL;DR: In this paper, a microwave plasma etching system is described, which comprises a vacuum chamber for providing a discharge space and provided with an inlet for introducing a discharge gas containing a fluorine-containing gas, magnetic field forming means (7) for forming a magnetic field in the discharge space, microwave electric field forming (3), and substrate holding means (11) for holding substrates to be processed in the vacuum chamber.
Journal ArticleDOI

Silicon Oxidation in an Oxygen Plasma Excited by Microwaves

TL;DR: In this paper, a preliminary study of the oxidation of silicon by a moderate density oxygen gas plasma has provided two methods for oxidizing silicon rapidly at low temperatures, which allow for masking against the growth of the film.
Patent

Methods and apparatus for generating plasmas

Birol Kuyel
TL;DR: In this article, a toroidal waveguide of rectangular cross-section connected to a microwave source is used to pre-ionize a reactive species, allowing independent control over the activation of both reactive species.
Journal ArticleDOI

A novel anisotropic dry etching technique

TL;DR: IBAE as mentioned in this paper is based upon the work of Coburn et al., and differs fundamentally from reactive ion etching (RIE), which relies upon a plasma to produce both the chemically active species and the energic ions.